M37546G4SP datasheet, PDF - EEWORLD Datasheet

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M37546G4SP: DescriptionSINGLE-CHIP 8-BIT CMOS MICROCOMPUTER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1013KB，95 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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M37546G4SP Overview

SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

M37546G4SP Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	DIP
package instruction	SDIP, SDIP32,.4
Contacts	32
Reach Compliance Code	compli
Has ADC	YES
Other features	ALSO OPERATES AT 1.8V MINIMUM SUPPLY
Address bus width
bit size	8
maximum clock frequency	8 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
length	28 mm
Number of I/O lines	25
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP32,.4
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	240
power supply	2/5 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	16384
ROM programmability	MROM
Maximum seat height	5.08 mm
speed	8 MHz
Maximum slew rate	9.5 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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7546 Group

SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

REJ03B0160-0121

Rev.1.21

Nov 15, 2006

DESCRIPTION

The 7546 Group is the QzROM version of 7542 Group.

The 7546 Group has the pin-compatibilty with the 7542 Group. As

new functions, the power-on reset, the low voltage detection cir-

cuit, and the function set ROM are added.

•

FEATURES

•

Basic machine-language instructions ...................................... 71

The minimum instruction execution time ............................. 0.25

µs

(at 8 MHz oscillation frequency, double-speed mode for the

shortest instruction)

Memory size

ROM ................................ 8K, 16K bytes

RAM ............................... 384, 512 bytes

Programmable I/O ports ........................................................... 25

Interrupts ................................................. 18 sources, 16 vectors

Timers ............................................................................. 8-bit

...................................................................................... 16-bit

Output compare ............................................................ 4-channel

Input capture ................................................................ 2-channel

Serial interface ............ 8-bit

2 (UART or Clock-synchronized)

A/D converter ............................................... 10-bit

6 channels

Clock generating circuit ............................................. Built-in type

(low-power dissipation by an on-chip oscillator)

(connected to external ceramic resonator or quartz-crystal

oscillator permitting RC oscillation)

•

Watchdog timer ............................................................ 16-bit

Power-on reset circuit ............................................... Built-in type

Low voltage detection circuit ..................................... Built-in type

Power source voltage

oscillation frequency at ceramic oscillation, in double-speed mode

At 8 MHz .................................................................... 4.5 to 5.5 V

At 6.5 MHz ................................................................. 4.0 to 5.5 V

At 2 MHz .................................................................... 2.4 to 5.5 V

At 1 MHz .................................................................... 2.2 to 5.5 V

oscillation frequency at ceramic oscillation, in high-speed

mode or middle-speed mode

At 8 MHz .................................................................... 4.0 to 5.5 V

At 4 MHz .................................................................... 2.4 to 5.5 V

At 2 MHz .................................................................... 2.2 to 5.5 V

oscillation frequency at RC oscillation in high-speed mode or

middle-speed mode

At 4 MHz .................................................................... 4.0 to 5.5 V

At 2 MHz .................................................................... 2.4 to 5.5 V

At 1 MHz .................................................................... 2.2 to 5.5 V

oscillation frequency at on-chip oscillation ......... 1.8 to 5.5 V

Power dissipation ................................................ 29.5 mW (Typ.)

Operating temperature range ................................... –20 to 85 °C

Rev.1.21 Nov 15, 2006

REJ03B0160-0121

page 1 of 93

M37546G4SP Related Products

	M37546G4SP	7546	M37546G2-XXXGP	M37546G2-XXXHP	M37546G2-XXXSP	M37546G4-XXXSP	M37546G4HP	M37546G4-XXXGP	M37546G4-XXXHP
Description	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
Is it lead-free?	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	DIP	-	QFP	QFN	DIP	DIP	QFN	QFP	QFN
package instruction	SDIP, SDIP32,.4	-	7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32	6 X 6 MM, 0.50 MM PITCH, PLASTIC, WQFN-36	SDIP, SDIP32,.4	8.90 X 28 MM, 1.78 MM PITCH, PLASTIC, SDIP-32	HVQCCN, LCC36,.25SQ,20	7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32	6 X 6 MM, 0.50 MM PITCH, PLASTIC, WQFN-36
Contacts	32	-	32	36	32	32	36	32	36
Reach Compliance Code	compli	-	unknow	unknow	compli	unknow	compli	unknow	unknow
Has ADC	YES	-	YES	YES	YES	YES	YES	YES	YES
Other features	ALSO OPERATES AT 1.8V MINIMUM SUPPLY	-	ALSO OPERATES AT 1.8V MINIMUM SUPPLY	ALSO OPERATES AT 1.8V MINIMUM SUPPLY	ALSO OPERATES AT 1.8V MINIMUM SUPPLY	ALSO OPERATES AT 1.8V MINIMUM SUPPLY	ALSO OPERATES AT 1.8V MINIMUM SUPPLY	ALSO OPERATES AT 1.8V MINIMUM SUPPLY	ALSO OPERATES AT 1.8V MINIMUM SUPPLY
bit size	8	-	8	8	8	8	8	8	8
maximum clock frequency	8 MHz	-	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
DAC channel	NO	-	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	-	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-PDIP-T32	-	S-PQFP-G32	S-PQCC-N36	R-PDIP-T32	R-PDIP-T32	S-PQCC-N36	S-PQFP-G32	S-PQCC-N36
JESD-609 code	e0	-	e0	-	e0	e0	-	e0	-
length	28 mm	-	7 mm	6 mm	28 mm	28 mm	6 mm	7 mm	6 mm
Number of I/O lines	25	-	25	25	25	25	25	25	25
Number of terminals	32	-	32	36	32	32	36	32	36
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-20 °C	-	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
PWM channel	NO	-	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SDIP	-	LQFP	HVQCCN	SDIP	SDIP	HVQCCN	LQFP	HVQCCN
Encapsulate equivalent code	SDIP32,.4	-	QFP32,.35SQ,32	LCC36,.25SQ,20	SDIP32,.4	SDIP32,.4	LCC36,.25SQ,20	QFP32,.35SQ,32	LCC36,.25SQ,20
Package shape	RECTANGULAR	-	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	IN-LINE, SHRINK PITCH	-	FLATPACK, LOW PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE, SHRINK PITCH	IN-LINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	FLATPACK, LOW PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	240	-	NOT SPECIFIED	240	240	240	240	NOT SPECIFIED	240
power supply	2/5 V	-	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	512	-	384	384	384	512	512	512	512
rom(word)	16384	-	8192	8192	8192	16384	16384	16384	16384
ROM programmability	MROM	-	MROM	MROM	MROM	MROM	MROM	MROM	MROM
Maximum seat height	5.08 mm	-	1.7 mm	0.8 mm	5.08 mm	5.08 mm	0.8 mm	1.7 mm	0.8 mm
speed	8 MHz	-	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
Maximum slew rate	9.5 mA	-	9.5 mA	9.5 mA	9.5 mA	9.5 mA	9.5 mA	9.5 mA	9.5 mA
Maximum supply voltage	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	-	YES	YES	NO	NO	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	-	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	TIN LEAD	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	-	GULL WING	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	GULL WING	NO LEAD
Terminal pitch	1.778 mm	-	0.8 mm	0.5 mm	1.778 mm	1.778 mm	0.5 mm	0.8 mm	0.5 mm
Terminal location	DUAL	-	QUAD	QUAD	DUAL	DUAL	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	-	7 mm	6 mm	10.16 mm	10.16 mm	6 mm	7 mm	6 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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