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M38046FFHFP: Description8-BIT CISC SINGLE-CHIP MICROCOMPUTER 740 FAMILY / 38000 SERIES; File Size3MB，387 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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8-BIT CISC SINGLE-CHIP MICROCOMPUTER 740 FAMILY / 38000 SERIES

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REJ09B0212-0100Z

3804 Group (Spec. H)

User’s Manual

RENESAS 8-BIT CISC SINGLE-CHIP MICROCOMPUTER

740 FAMILY / 38000 SERIES

Before using this material, please visit our website to confirm that this is the most

current document available.

Rev. 1.00

Revision date: Jan 14, 2005

www.renesas.com

Keep safety first in your circuit designs!

Renesas Technology Corp. puts the maximum effort into making semiconductor products

better and more reliable, but there is always the possibility that trouble may occur with

them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with ap-

propriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-

flammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

These materials are intended as a reference to assist our customers in the selection of the

Renesas Technology Corp. product best suited to the customer's application; they do not

convey any license under any intellectual property rights, or any other rights, belonging to

Renesas Technology Corp. or a third party.

Renesas Technology Corp. assumes no responsibility for any damage, or infringement of

any third-party's rights, originating in the use of any product data, diagrams, charts, pro-

grams, algorithms, or circuit application examples contained in these materials.

All information contained in these materials, including product data, diagrams, charts, pro-

grams and algorithms represents information on products at the time of publication of these

materials, and are subject to change by Renesas Technology Corp. without notice due to

product improvements or other reasons. It is therefore recommended that customers con-

tact Renesas Technology Corp. or an authorized Renesas Technology Corp. product dis-

tributor for the latest product information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other

loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by vari-

ous means, including the Renesas Technology Corp. Semiconductor home page (http://

www.renesas.com).

When using any or all of the information contained in these materials, including product

data, diagrams, charts, programs, and algorithms, please be sure to evaluate all informa-

tion as a total system before making a final decision on the applicability of the information

and products. Renesas Technology Corp. assumes no responsibility for any damage, liabil-

ity or other loss resulting from the information contained herein.

Renesas Technology Corp. semiconductors are not designed or manufactured for use in a

device or system that is used under circumstances in which human life is potentially at

stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology

Corp. product distributor when considering the use of a product contained herein for any

specific purposes, such as apparatus or systems for transportation, vehicular, medical,

aerospace, nuclear, or undersea repeater use.

The prior written approval of Renesas Technology Corp. is necessary to reprint or repro-

duce in whole or in part these materials.

If these products or technologies are subject to the Japanese export control restrictions,

they must be exported under a license from the Japanese government and cannot be im-

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Please contact Renesas Technology Corp. for further details on these materials or the

products contained therein.

Table of contents

3804 Group (Spec.H)

Table of contents

CHAPTER 1 HARDWARE

DESCRIPTION ................................................................................................................................ 1-2

FEATURES ...................................................................................................................................... 1-2

PIN CONFIGURATION .................................................................................................................. 1-3

FUNCTIONAL BLOCK .................................................................................................................. 1-4

PIN DESCRIPTION ........................................................................................................................ 1-5

PART NUMBERING ....................................................................................................................... 1-6

GROUP EXPANSION .................................................................................................................... 1-7

Memory Size ............................................................................................................................. 1-7

Packages ................................................................................................................................... 1-7

FUNCTIONAL DESCRIPTION ...................................................................................................... 1-8

CENTRAL PROCESSING UNIT (CPU) ................................................................................. 1-8

MEMORY ................................................................................................................................. 1-13

I/O PORTS .............................................................................................................................. 1-15

INTERRUPTS .......................................................................................................................... 1-23

TIMERS ................................................................................................................................... 1-27

SERIAL INTERFACE ............................................................................................................. 1-40

PULSE WIDTH MODULATION (PWM) ................................................................................ 1-54

A/D CONVERTER .................................................................................................................. 1-56

D/A CONVERTER .................................................................................................................. 1-58

WATCHDOG TIMER .............................................................................................................. 1-59

MULTI-MASTER I

C-BUS INTERFACE ............................................................................... 1-60

RESET CIRCUIT .................................................................................................................... 1-74

CLOCK GENERATING CIRCUIT ......................................................................................... 1-76

FLASH MEMORY MODE ...................................................................................................... 1-80

NOTES ON PROGRAMMING ..................................................................................................... 1-99

NOTES ON USAGE ................................................................................................................... 1-100

FUNCTIONAL DESCRIPTION SUPPLEMENT ....................................................................... 1-101

Interrupt ................................................................................................................................. 1-101

Timing After Interrupt ........................................................................................................... 1-102

A/D Converter ....................................................................................................................... 1-103

CHAPTER 2 APPLICATION

2.1 I/O port ..................................................................................................................................... 2-2

2.1.1 Memory map ................................................................................................................... 2-2

2.1.2 Relevant registers .......................................................................................................... 2-3

2.1.3 Port Pi pull-up control register ..................................................................................... 2-5

2.1.4 Terminate unused pins .................................................................................................. 2-5

2.1.5 Notes on I/O port ........................................................................................................... 2-6

2.1.6 Termination of unused pins .......................................................................................... 2-7

2.2 Interrupt ................................................................................................................................... 2-8

2.2.1 Memory map ................................................................................................................... 2-8

2.2.2 Relevant registers .......................................................................................................... 2-8

2.2.3 Interrupt source ............................................................................................................ 2-12

2.2.4 Interrupt operation ........................................................................................................ 2-13

Rev.1.00 Jan 14, 2005

REJ09B0212-0100Z

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