To all our customers
Regarding the change of names mentioned in the document, such as Mitsubishi
Electric and Mitsubishi XX, to Renesas Technology Corp.
The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi
Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names
have in fact all been changed to Renesas Technology Corp. Thank you for your understanding.
Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been
made to the contents of the document, and these changes do not constitute any alteration to the
contents of the document itself.
Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices
and power devices.
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Keep safety first in your circuit designs!
•
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor prod-
ucts better and more reliable, but there is always the possibility that trouble may occur with
them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with ap-
propriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-
flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
•
•
•
•
•
•
•
•
These materials are intended as a reference to assist our customers in the selection of the
Mitsubishi semiconductor product best suited to the customer's application; they do not
convey any license under any intellectual property rights, or any other rights, belonging to
Mitsubishi Electric Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement
of any third-party's rights, originating in the use of any product data, diagrams, charts,
programs, algorithms, or circuit application examples contained in these materials.
All information contained in these materials, including product data, diagrams, charts, pro-
grams and algorithms represents information on products at the time of publication of these
materials, and are subject to change by Mitsubishi Electric Corporation without notice due
to product improvements or other reasons. It is therefore recommended that customers
contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product
distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other
loss rising from these inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by
various means, including the Mitsubishi Semiconductor home page (http://
www.mitsubishichips.com).
When using any or all of the information contained in these materials, including product
data, diagrams, charts, programs, and algorithms, please be sure to evaluate all informa-
tion as a total system before making a final decision on the applicability of the information
and products. Mitsubishi Electric Corporation assumes no responsibility for any damage,
liability or other loss resulting from the information contained herein.
Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use
in a device or system that is used under circumstances in which human life is potentially at
stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semicon-
ductor product distributor when considering the use of a product contained herein for any
specific purposes, such as apparatus or systems for transportation, vehicular, medical,
aerospace, nuclear, or undersea repeater use.
The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or repro-
duce in whole or in part these materials.
If these products or technologies are subject to the Japanese export control restrictions,
they must be exported under a license from the Japanese government and cannot be im-
ported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/
or the country of destination is prohibited.
Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor
product distributor for further details on these materials or the products contained therein.
REVISION HISTORY
Rev.
1.0
1.1
Date
Page
07/07/00
03/10/00
74
100
First Edition
38B7 GROUP USER’S MANUAL
Description
Summary
Mask options B to G are shaded to show that they cannoto be specified. Note 4
added.
Absolute maximum ratings
VEE VCC–45 to VCC +0.3
VI
VCC–45 to VCC +0.3
VO VCC–45 to VCC +0.3
Explanations of “DESCRIPTION” are partly eliminated.
Oscillation frequency value of “FEATURES” are partly revised.
Figure 3 is partly revised.
Figure 4 is partly revised.
“MASK OPTION OF PULL-DOWN RESISTOR” is eliminated.
Explanations of “sNote” are revised.
“sNotes” is added.
“Electric Characteristic Differences Between Mask ROM and Flash Memory Ver-
sion MCUs” is added.
Sub clause name and explanations of “(7) Setting procedure when serial I/O2
transmit interrupt is used” are revised.
Clause name and explanations of “2.11.3 Each port state during “L” state of
RESET pin” are revised.
Table name of Table 2.11.1 is revised.
Note of Table 2.11.1 is eliminated.
Table 2.13.1 is partly revised.
Explanations of “2.13.5 Serial I/O mode” are partly revised.
Table 2.13.2 is partly revised.
Figure 3.2.2 is revised.
Sub clause name and explanations of “(1) Change of relevant register settings”
are revised.
Sub clause name and explanations of “(7) Setting procedure when serial I/O2
transmit interrupt is used” are revised.
Clause name and explanations of “3.3.11 Each port state during “L” state of
RESET pin” are revised.
Table name of Table 3.3.3 is revised.
1.2
11/01/01
1-2
1-2
1-7
1-8
1-75
1-21
1-41
1-100
2-91
2-164
2-164
2-164
2-177
2-177
2-177
3-10
3-15
3-21
3-23
3-23
1.3
01/29/03
(1/1)
Wireless Connectivity
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