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AM27C512-70JI

Description
OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size100KB,12 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM27C512-70JI Overview

OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32

AM27C512-70JI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density524288 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.55 mm
Maximum standby current0.0001 A
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
Base Number Matches1
FINAL
Am27C512
512 Kilobit (64 K x 8-Bit) CMOS EPROM
DISTINCTIVE CHARACTERISTICS
n
Fast access time
— Speed options as fast as 55 ns
n
Low power consumption
— 20 µA typical CMOS standby current
n
JEDEC-approved pinout
n
Single +5 V power supply
n
±10%
power supply tolerance standard
n
100% Flashrite™ programming
— Typical programming time of 8 seconds
n
Latch-up protected to 100 mA from –1 V to
V
CC
+ 1 V
n
High noise immunity
n
Versatile features for simple interfacing
— Both CMOS and TTL input/output compatibility
— Two line control functions
n
Standard 28-pin DIP, PDIP, and 32-pin PLCC
packages
GENERAL DESCRIPTION
The Am27C512 is a 512-Kbit, ultraviolet erasable pro-
grammable read-only memory. It is organized as 64K
words by 8 bits per word, operates from a single +5 V
supply, has a static standby mode, and features fast
single address location programming. Products are
available in windowed ceramic DIP packages, as well
as plastic one time programmable (OTP) PDIP and
PLCC packages.
Data can be typically accessed in less than 55 ns, al-
lowing high-performance microprocessors to operate
without any WAIT states. The device offers separate
Output Enable (OE#) and Chip Enable (CE#) controls,
thus eliminating bus contention in a multiple bus micro-
processor system.
AMD’s CMOS process technology provides high
speed, low power, and high noise immunity. Typical
power consumption is only 80 mW in active mode, and
100 µW in standby mode.
All signals are TTL levels, including programming sig-
nals. Bit locations may be programmed singly, in
blocks, or at random. The device supports AMD’s
Flashrite programming algorithm (100 µs pulses), re-
sulting in a typical programming time of 8 seconds.
BLOCK DIAGRAM
V
CC
V
SS
OE#/V
PP
CE#
Output Enable
Chip Enable
and
Prog Logic
Y
Decoder
A0–A15
Address
Inputs
Output
Buffers
Data Outputs
DQ0–DQ7
Y
Gating
X
Decoder
524,288
Bit Cell
Matrix
08140J-1
Publication#
08140
Rev:
J
Amendment/+2
Issue Date:
June 1, 1999

AM27C512-70JI Related Products

AM27C512-70JI AM27C512-90JI AM27C512-90PI AM27C512-55PC5 AM27C512-55JC5 AM27C512-200JI AM27C512-55DC5 AM27C512-200JC AM27C512-150PI AM27C512-70JC
Description OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 90ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 55ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 UVPROM, 64KX8, 55ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 OTP ROM, 64KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFJ QFJ DIP DIP QFJ QFJ DIP QFJ DIP QFJ
package instruction QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 DIP, DIP28,.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 WDIP, DIP28,.6 QCCJ, LDCC32,.5X.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6
Contacts 32 32 28 28 32 32 28 32 28 32
Reach Compliance Code unknown unknow unknow unknow unknow unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 70 ns 90 ns 90 ns 55 ns 55 ns 200 ns 55 ns 200 ns 150 ns 70 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQCC-J32 R-PQCC-J32 R-PDIP-T28 R-PDIP-T28 R-PQCC-J32 R-PQCC-J32 R-CDIP-T28 R-PQCC-J32 R-PDIP-T28 R-PQCC-J32
length 13.97 mm 13.97 mm 37.084 mm 37.084 mm 13.97 mm 13.97 mm 37.1475 mm 13.97 mm 37.084 mm 13.97 mm
memory density 524288 bit 524288 bi 524288 bi 524288 bi 524288 bi 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM UVPROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 28 28 32 32 28 32 28 32
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C
organize 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ DIP DIP QCCJ QCCJ WDIP QCCJ DIP QCCJ
Encapsulate equivalent code LDCC32,.5X.6 LDCC32,.5X.6 DIP28,.6 DIP28,.6 LDCC32,.5X.6 LDCC32,.5X.6 DIP28,.6 LDCC32,.5X.6 DIP28,.6 LDCC32,.5X.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE, WINDOW CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 220 NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.55 mm 3.55 mm 5.715 mm 5.715 mm 3.55 mm 3.55 mm 5.588 mm 3.55 mm 5.715 mm 3.55 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA 0.025 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.25 V 5.25 V 5.5 V 5.25 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.75 V 4.75 V 4.5 V 4.75 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO YES YES NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal form J BEND J BEND THROUGH-HOLE THROUGH-HOLE J BEND J BEND THROUGH-HOLE J BEND THROUGH-HOLE J BEND
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD QUAD DUAL DUAL QUAD QUAD DUAL QUAD DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 11.43 mm 15.24 mm 15.24 mm 11.43 mm 11.43 mm 15.24 mm 11.43 mm 15.24 mm 11.43 mm
JESD-609 code e0 - e0 e0 e0 e0 e0 e0 e0 e0
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Base Number Matches 1 1 1 1 1 1 1 1 1 -

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