CYM1838HG-20M datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> CYM1838HG-20M

CYM1838HG-20M: DescriptionSRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66; Categorystorage storage; File Size214KB，6 Pages; ManufacturerCypress Semiconductor

Download Datasheet Parametric Compare View All

CYM1838HG-20M Overview

SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66

CYM1838HG-20M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
Contacts	66
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	20 ns
I/O type	COMMON
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	8.128 mm
Maximum standby current	0.04 A
Minimum standby current	4.5 V
Maximum slew rate	0.72 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

Preview

Download Datasheet

View All

This Material Copyrighted By Its Respective Manufacturer

CYM1838HG-20M Related Products

	CYM1838HG-20M	CYM1838HG-35C	CYM1838HG-20C	CYM1838HG-35M	CYM1838HG-25M	CYM1838HG-20MB	CYM1838HG-25C
Description	SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	PGA	PGA	PGA	PGA	PGA	PGA	PGA
package instruction	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66	1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
Contacts	66	66	66	66	66	66	66
Reach Compliance Code	compliant	not_compliant	compliant	not_compliant	not_compliant	compliant	not_compliant
ECCN code	3A001.A.2.C	3A991.B.2.A	3A991.B.2.A	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A991.B.2.A
Maximum access time	20 ns	35 ns	20 ns	35 ns	25 ns	20 ns	25 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	66	66	66	66	66	66	66
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	70 °C	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-	-	-55 °C	-55 °C	-55 °C	-
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	PGA	PGA	PGA	PGA	PGA
Encapsulate equivalent code	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	8.128 mm	8.128 mm	8.128 mm	8.128 mm	8.128 mm	8.128 mm	8.128 mm
Maximum standby current	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.72 mA	0.72 mA	0.72 mA	0.72 mA	0.72 mA	0.72 mA	0.72 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1	1	1	1	1	-
Other features	-	CONFIGURABLE AS 128K X 32	-	CONFIGURABLE AS 128K X 32	CONFIGURABLE AS 128K X 32	-	CONFIGURABLE AS 128K X 32
Number of ports	-	1	-	1	1	-	1
Exportable	-	YES	-	YES	YES	-	YES

Recommended Resources

This application circuit of LM135-235-335

Light controlled motor drive circuit

HG40 series thyristor capacitor switch wiring

TDA1521 power amplifier circuit diagram

adjustable resistor symbol

Gree program-controlled leaf fan circuit

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components