|
CYM1838HG-35M |
CYM1838HG-35C |
CYM1838HG-20C |
CYM1838HG-20M |
CYM1838HG-25M |
CYM1838HG-20MB |
CYM1838HG-25C |
| Description |
SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
PGA |
PGA |
PGA |
PGA |
PGA |
PGA |
PGA |
| package instruction |
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66 |
| Contacts |
66 |
66 |
66 |
66 |
66 |
66 |
66 |
| Reach Compliance Code |
not_compliant |
not_compliant |
compliant |
compliant |
not_compliant |
compliant |
not_compliant |
| ECCN code |
3A001.A.2.C |
3A991.B.2.A |
3A991.B.2.A |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A991.B.2.A |
| Maximum access time |
35 ns |
35 ns |
20 ns |
20 ns |
25 ns |
20 ns |
25 ns |
| I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 code |
S-CPGA-P66 |
S-CPGA-P66 |
S-CPGA-P66 |
S-CPGA-P66 |
S-CPGA-P66 |
S-CPGA-P66 |
S-CPGA-P66 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| memory density |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
| Memory IC Type |
SRAM MODULE |
SRAM MODULE |
SRAM MODULE |
SRAM MODULE |
SRAM MODULE |
SRAM MODULE |
SRAM MODULE |
| memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
66 |
66 |
66 |
66 |
66 |
66 |
66 |
| word count |
524288 words |
524288 words |
524288 words |
524288 words |
524288 words |
524288 words |
524288 words |
| character code |
512000 |
512000 |
512000 |
512000 |
512000 |
512000 |
512000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
125 °C |
70 °C |
70 °C |
125 °C |
125 °C |
125 °C |
70 °C |
| Minimum operating temperature |
-55 °C |
- |
- |
-55 °C |
-55 °C |
-55 °C |
- |
| organize |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
PGA |
PGA |
PGA |
PGA |
PGA |
PGA |
PGA |
| Encapsulate equivalent code |
PGA66,11X11 |
PGA66,11X11 |
PGA66,11X11 |
PGA66,11X11 |
PGA66,11X11 |
PGA66,11X11 |
PGA66,11X11 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
8.128 mm |
8.128 mm |
8.128 mm |
8.128 mm |
8.128 mm |
8.128 mm |
8.128 mm |
| Maximum standby current |
0.04 A |
0.04 A |
0.04 A |
0.04 A |
0.04 A |
0.04 A |
0.04 A |
| Minimum standby current |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Maximum slew rate |
0.72 mA |
0.72 mA |
0.72 mA |
0.72 mA |
0.72 mA |
0.72 mA |
0.72 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
COMMERCIAL |
COMMERCIAL |
MILITARY |
MILITARY |
MILITARY |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Other features |
CONFIGURABLE AS 128K X 32 |
CONFIGURABLE AS 128K X 32 |
- |
- |
CONFIGURABLE AS 128K X 32 |
- |
CONFIGURABLE AS 128K X 32 |
| Number of ports |
1 |
1 |
- |
- |
1 |
- |
1 |
| Exportable |
YES |
YES |
- |
- |
YES |
- |
YES |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
- |