AS7C251MPFD18A-166TQI datasheet, PDF

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AS7C251MPFD18A-166TQI: DescriptionStandard SRAM, 1MX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100; Categorystorage storage; File Size510KB，19 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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AS7C251MPFD18A-166TQI Overview

Standard SRAM, 1MX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

AS7C251MPFD18A-166TQI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	LQFP,
Contacts	100
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	3.5 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	18874368 bit
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of terminals	100
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
Base Number Matches	1

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February 2005

AS7C251MPFD18A

2.5V 1M x 18 pipelined burst synchronous SRAM

Features

•

Organization: 1,048,576 x18 bits

Fast clock speeds to 166 MHz

Fast clock to data access: 3.5/3.8 ns

Fast OE access time: 3.5/3.8 ns

Fully synchronous register-to-register operation

Double-cycle deselect

Asynchronous output enable control

Available 100-pin TQFP package

•

Individual byte write and global write

Multiple chip enables for easy expansion

2.5V core power supply

Linear or interleaved burst control

Snooze mode for reduced power-standby

Common data inputs and data outputs

Logic block diagram

LBO

CLK

ADV

ADSC

ADSP

A[19:0]

CLK

CLR

Burst logic

Address

18 20

Memory

array

CLK

GWE

BWE

CE0

CE1

CE2

DQb

CLK

DQa

Byte Write

registers

Byte Write

registers

CLK

Enable

Output

registers

CLK

Input

registers

CLK

Power

down

Enable

delay

CLK

DQ[a,b]

Selection guide

-166

Minimum cycle time

Maximum clock frequency

Maximum clock access time

Maximum operating current

Maximum standby current

Maximum CMOS standby current (DC)

166

3.5

290

-133

7.5

133

3.8

270

Units

MHz

2/10/05, v. 1.2

Alliance Semiconductor

1 of 19

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	AS7C251MPFD18A-166TQI	AS7C251MPFD18A-133TQC	AS7C251MPFD18A-133TQCN	AS7C251MPFD18A-166TQCN	AS7C251MPFD18A-166TQIN	AS7C251MPFD18A-133TQI	AS7C251MPFD18A-166TQC
Description	Standard SRAM, 1MX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Standard SRAM, 1MX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Standard SRAM, 1MX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100	Standard SRAM, 1MX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100	Standard SRAM, 1MX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100	Standard SRAM, 1MX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100	Standard SRAM, 1MX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Is it lead-free?	Contains lead	Contains lead	Lead free	Lead free	Lead free	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	conform to	conform to	conform to	incompatible	incompatible
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,
Contacts	100	100	100	100	100	100	100
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	3.5 ns	3.8 ns	3.8 ns	3.5 ns	3.5 ns	3.8 ns	3.5 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e0	e3	e3	e3	e0	e0
length	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	18	18	18	18	18	18	18
Number of functions	1	1	1	1	1	1	1
Number of terminals	100	100	100	100	100	100	100
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C	70 °C
organize	1MX18	1MX18	1MX18	1MX18	1MX18	1MX18	1MX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	245	245	245	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum supply voltage (Vsup)	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	MATTE TIN	MATTE TIN	MATTE TIN	TIN LEAD	TIN LEAD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	30	30	30	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Base Number Matches	1	1	1	1	1	-	-
Maker	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )

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