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M1A3P600L-1FG484

Description
Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, 13824-Cell, CMOS, PBGA484, 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
CategoryProgrammable logic devices    Programmable logic   
File Size7MB,224 Pages
ManufacturerActel
Websitehttp://www.actel.com/
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M1A3P600L-1FG484 Overview

Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, 13824-Cell, CMOS, PBGA484, 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

M1A3P600L-1FG484 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
Reach Compliance Codecompliant
maximum clock frequency350 MHz
JESD-30 codeS-PBGA-B484
JESD-609 codee0
length23 mm
Humidity sensitivity level3
Configurable number of logic blocks13824
Equivalent number of gates600000
Number of entries235
Number of logical units13824
Output times235
Number of terminals484
Maximum operating temperature70 °C
Minimum operating temperature
organize13824 CLBS, 600000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA484,22X22,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1.5/3.3 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height2.44 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width23 mm
Base Number Matches1
Revision 9
ProASIC3L Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
• Dramatic Reduction in Dynamic and Static Power Savings
• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power
• Low Power Consumption in Flash*Freeze Mode Allows for
Instantaneous Entry to / Exit from Low-Power Flash*Freeze
Mode
• Supports Single-Voltage System Operation
• Low-Impedance Switches
®
High Capacity
• 250,000 to 3,000,000 System Gates
• Up to 504 kbits of True Dual-Port SRAM
• Up to 620 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Live-at-Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II (A3PE3000L only)
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold-Sparing I/Os Programmable Output
Slew Rate and Drive Strength
• Programmable Input Delay (A3PE3000L only)
• Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC
®
3L Family
(except PQ208)
High Performance
• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System
Performance
• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit
PCI (1.2 V systems)
Clock Conditioning Circuit (CCC) and PLL
• Six CCC Blocks, One with Integrated PLL (ProASIC3L) and All
with Integrated PLL (ProASIC3EL)
• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
• Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V
systems) and 350 MHz (1.5 V systems))
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock
®
to Secure FPGA Contents
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• 24 SRAM and FIFO Configurations with Synchronous
Operation:
– 250 MHz: For 1.2 V systems
– 350 MHz: For 1.5 V systems
• ARM Cortex™-M1 Soft Processor Available with or without
Debug
A3P1000L
M1A3P1000L
1,000,000
24,576
144
32
1
Yes
1
18
4
300
A3PE3000L
M1A3PE3000L
3,000,000
75,264
504
112
1
Yes
6
18
8
620
PQ208
3
FG324, FG484, FG896
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
• High-Performance, Low-Skew Global Network
• Architecture Supports Ultra-High Utilization
Advanced and Pro (Professional) I/Os
• 700 Mbps DDR, LVDS-Capable I/Os
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 8 Banks per Chip
ARM
®
Processor Support in ProASIC3L FPGAs
Table 1 • ProASIC3 Low-Power Product Family
ProASIC3L Devices
A3P250L
A3P600L
ARM Cortex-M1 Devices
1
M1A3P600L
System Gates
250,000
600,000
VersaTiles (D-flip-flops)
6,144
13,824
RAM Kbits (1,024 bits)
36
108
4,608-Bit Blocks
8
24
FlashROM Kbits
1
1
2
Secure (AES) ISP
Yes
Yes
3
Integrated PLL in CCCs
1
1
VersaNet Globals
18
18
I/O Banks
4
4
Maximum User I/Os
157
235
Package Pins
VQFP
VQ100
PQFP
PQ208
PQ208
FBGA
FG144, FG256
FG144, FG256, FG484
Notes:
1. Refer to the
Cortex-M1
product brief for more information.
2. AES is not available for ARM Cortex-M1 ProASIC3L devices.
3. For the A3PE3000L, the PQ208 package has six CCCs and two PLLs.
PQ208
FG144, FG256, FG484
February 2009
© 2010 Actel Corporation
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