MINIATURE CYLINDER HIGH FREQUENCY CRYSTAL
AB145
*RoHS COMPLIANT
APPLICATIONS:
• Communications equipment
• Measuring instruments
• Audio and video equipment
5.1 x 1.5mm
| | | | | | | | | | | | | | |
FEATURES:
• Miniature high frequency crystals
• Excellent frequency vs. temperature stability
• Industrial temperature range available
• Hand held devices
• Portable electronics
• Microprocessor clocks
STANDARD SPECIFICATIONS:
PARAMETERS
Nominal Frequency
Operating Temperature
Storage Temperature
Frequency Tolerance
Frequency Stability
Equivalent Series Resistance
Load Capacitance CL
Shunt Capacitance
Drive Level
Aging at 25°C/year
Insulation Resistance
16.000MHz - 70.000MHz
-10°C to + 60°C
-40°C to +85°C
± 30 ppm max. at +25°C (see option)
± 30 ppm max. (see option)
See Table 1
16pF (see option)
7pF
500
µ
W max., 100
µ
W correlation
± 5ppm max.
500 M
Ω
min. at 100 Vdc
± 15V
OPTIONS AND PART IDENTIFICATION
(Left blank if standard):
AB145 - Frequency - CL - ESR - Tolerance - Stability - Packaging
CL options:
Load cap. in pF (minimum 10 pF)
S for Series Resonance
Freq Stability options:
U
for ± 10 ppm max.
G
for ± 15 ppm max.
X
for ± 20 ppm max.
W
for ± 25 ppm max.
H
for ± 35 ppm max.
Z
for ± 50 ppm max.
ESR options:
RXXX (value in ohms max.)
Freq Tolerance options:
1
for ± 10 ppm max.
7
for ± 15 ppm max.
2
for ± 20 ppm max.
3
for ± 25 ppm max.
5
for ± 50 ppm max.
Packaging option:
T for Tape and Reel
OUTLINE DRAWING:
Dimensions: inch (mm)
TABLE 1:
Frequency Range (MHz)
16.000 to 19.999 (Fund)
20.000 to 29.999 (Fund)
30.000 to 70.000 (3
rd
OT)
Max ESR (
Ω )
40
30
100
ENVIRONMENTAL AND MECHANICAL SPECIFICATIONS:
•
Shock: Drop test of 3 times on a hard board from 75cm. ±5ppm max. R within spec.
•
Vibration: Frequency with an amplitude of 1.5mm or accelearation 10g sweeping between 10Hz to
55Hz within 1 minute for 2 hours minimum on each axis. (X, Y, Z). ±5ppm max. R within spec.
•
Terminal strength: Apply 0.5kg load to each terminal and sustain it for 30±5seconds.
No visible damage
•
Solderability: Dip terminals in RMA flux for 5±0.5sec at room temp. then solder dip at 230°C ± 5°C
for 5±0.5sec. 90% coverage with fresh solder.
•
Leak test: Take measurments with Helium leak detector. 1*10
-2
µ
Pa*m
3
/S
•
Thermal Shock: Subject to 5 temperature cycles from -40°C for 30min to 100°C for 30min each cycle.
Variation between pre-test and post-test frequencies shall remain between ±5ppm. R within spec.
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
rev1.1-8/05
30332 Esperanza, Rancho Santa Margarita, California 92688
tel 949-546-8000
|
fax 949-546-8001
| www.abracon.com
Microcontroller MCU
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