AM9401DCB datasheet, PDF - EEWORLD Datasheet

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AM9401DCB: DescriptionShift Register, 1024-Bit, MOS, CDIP16; Categorylogic logic; File Size253KB，4 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM9401DCB Overview

Shift Register, 1024-Bit, MOS, CDIP16

AM9401DCB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Maximum Frequency@Nom-Sup	2000000 Hz
Number of digits	1024
Number of functions	2
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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AM9401DCB Related Products

	AM9401DCB	AM9401DMB	AM9401DCTB	AM9401DCT	AM9401PCTB	AM9401PCT	AM9401PCB
Description	Shift Register, 1024-Bit, MOS, CDIP16	Shift Register, 1024-Bit, MOS, CDIP16	Shift Register, 1024-Bit, MOS, CDIP16	Shift Register, 1024-Bit, MOS, CDIP16	Shift Register, 1024-Bit, MOS, PDIP16	Shift Register, 1024-Bit, MOS, PDIP16	Shift Register, 1024-Bit, MOS, PDIP16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	compliant	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Maximum Frequency@Nom-Sup	2000000 Hz	2000000 Hz	2000000 Hz	2000000 Hz	2000000 Hz	2000000 Hz	2000000 Hz
Number of digits	1024	1024	1024	1024	1024	1024	1024
Number of functions	2	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	-	-	-

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