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BDS16SMD

Description
8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size21KB,2 Pages
ManufacturerSEMELAB
Download Datasheet Parametric Compare View All

BDS16SMD Overview

8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN

BDS16SMD Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeTO-276AB
package instructionCHIP CARRIER, R-CBCC-N3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Shell connectionCOLLECTOR
Maximum collector current (IC)8 A
Collector-emitter maximum voltage120 V
ConfigurationSINGLE
Minimum DC current gain (hFE)15
JEDEC-95 codeTO-276AB
JESD-30 codeR-CBCC-N3
Number of components1
Number of terminals3
Maximum operating temperature200 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeNPN
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Nominal transition frequency (fT)30 MHz
Base Number Matches1
BDS16 BDS16SMD
BDS17 BDS17SMD
MECHANICAL DATA
Dimensions in mm
1 0.6
0.8
4.6
16.5
3.6
Dia.
1 3 .5
1 0 .6
SILICON NPN
EPITAXIAL BASE
IN TO220 METAL AND
SMD1 CERAMIC SURFACE
MOUNT PACKAGES
FEATURES
1 23
1 3 .7 0
1.0
2 .5 4
BSC
0 .8 9
(0 .0 3 5 )
m in .
3 .7 0 (0 .1 4 6 )
3 .7 0 (0 .1 4 6 )
3 .4 1 (0 .1 3 4 )
3 .4 1 (0 .1 3 4 )
4 .1 4 (0 .1 6 3 )
3 .8 4 (0 .1 5 1 )
2. 70
BSC
HERMETIC METAL OR CERAMIC PACKAGES
HIGH RELIABILITY
MILITARY AND SPACE OPTIONS
SCREENING TO CECC LEVELS
FULLY ISOLATED (METAL VERSION)
3 .6 0 (0 .1 4 2 )
M a x .
1
3
0 .7 6
(0 .0 3 0 )
m in .
APPLICATIONS
1 6 .0 2 (0 .6 3 1 )
1 5 .7 3 (0 .6 1 9 )
1 0 .6 9 (0 .4 2 1 )
1 0 .3 9 (0 .4 0 9 )
2
• POWER LINEAR AND SWITCHING
APPLICATIONS
• GENERAL PURPOSE POWER
9 .6
9 .3
1 1 .5
1 1 .2
7 (0
8 (0
8 (0
8 (0
.3 8
.3 6
.4 5
.4 4
1 )
9 )
6 )
4 )
0 .5 0 (0 .0 2 0 )
0 .2 6 (0 .0 1 0 )
TO220M
SMD1
Pin 1
– Base
- TO220 Metal Package - Isolated
- Ceramic Surface Mount Package
Pin 2
– Collector
Pin 3
– Emitter
ABSOLUTE MAXIMUM RATINGS
(T
case
=25°C unless otherwise stated)
V
CBO
V
CEO
V
EBO
I
E
, I
C
I
B
P
tot
T
stg
T
j
Semelab plc.
Collector - Base voltage (I
E
= 0)
Collector - Emitter voltage (I
B
= 0)
Emitter - Base voltage (I
C
= 0)
Emitter , Collector current
Base current
Total power dissipation at T
case
£
75°C
Storage Temperature
Junction Temperature
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
BDS16
120V
120V
BDS17
150V
150V
5V
8A
2A
50W
–65 TO 200°C
200°C
Prelim. 7/00

BDS16SMD Related Products

BDS16SMD BDS17SMD BDS16 BDS17
Description 8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN 8A, 150V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN 8A, 120V, NPN, Si, POWER TRANSISTOR, HERMETIC SEALED, METAL, TO-220M, 3 PIN 8A, 150V, NPN, Si, POWER TRANSISTOR, HERMETIC SEALED, METAL, TO-220M, 3 PIN
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Parts packaging code TO-276AB TO-276AB TO-220M TO-220M
package instruction CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 FLANGE MOUNT, S-MSFM-P3 FLANGE MOUNT, S-MSFM-P3
Contacts 3 3 3 3
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Other features HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY
Shell connection COLLECTOR COLLECTOR ISOLATED ISOLATED
Maximum collector current (IC) 8 A 8 A 8 A 8 A
Collector-emitter maximum voltage 120 V 150 V 120 V 150 V
Configuration SINGLE SINGLE SINGLE SINGLE
Minimum DC current gain (hFE) 15 15 15 15
JESD-30 code R-CBCC-N3 R-CBCC-N3 S-MSFM-P3 S-MSFM-P3
Number of components 1 1 1 1
Number of terminals 3 3 3 3
Maximum operating temperature 200 °C 200 °C 200 °C 200 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED METAL METAL
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Polarity/channel type NPN NPN NPN NPN
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES NO NO
Terminal form NO LEAD NO LEAD PIN/PEG PIN/PEG
Terminal location BOTTOM BOTTOM SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
transistor applications SWITCHING SWITCHING SWITCHING SWITCHING
Transistor component materials SILICON SILICON SILICON SILICON
Nominal transition frequency (fT) 30 MHz 30 MHz 30 MHz 30 MHz

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