8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | TO-276AB |
| package instruction | CHIP CARRIER, R-CBCC-N3 |
| Contacts | 3 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Other features | HIGH RELIABILITY |
| Shell connection | COLLECTOR |
| Maximum collector current (IC) | 8 A |
| Collector-emitter maximum voltage | 120 V |
| Configuration | SINGLE |
| Minimum DC current gain (hFE) | 15 |
| JEDEC-95 code | TO-276AB |
| JESD-30 code | R-CBCC-N3 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 200 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | NPN |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal form | NO LEAD |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| Nominal transition frequency (fT) | 30 MHz |
| Base Number Matches | 1 |

| BDS16SMD | BDS17SMD | BDS16 | BDS17 | |
|---|---|---|---|---|
| Description | 8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN | 8A, 150V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN | 8A, 120V, NPN, Si, POWER TRANSISTOR, HERMETIC SEALED, METAL, TO-220M, 3 PIN | 8A, 150V, NPN, Si, POWER TRANSISTOR, HERMETIC SEALED, METAL, TO-220M, 3 PIN |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | TO-276AB | TO-276AB | TO-220M | TO-220M |
| package instruction | CHIP CARRIER, R-CBCC-N3 | CHIP CARRIER, R-CBCC-N3 | FLANGE MOUNT, S-MSFM-P3 | FLANGE MOUNT, S-MSFM-P3 |
| Contacts | 3 | 3 | 3 | 3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY |
| Shell connection | COLLECTOR | COLLECTOR | ISOLATED | ISOLATED |
| Maximum collector current (IC) | 8 A | 8 A | 8 A | 8 A |
| Collector-emitter maximum voltage | 120 V | 150 V | 120 V | 150 V |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE |
| Minimum DC current gain (hFE) | 15 | 15 | 15 | 15 |
| JESD-30 code | R-CBCC-N3 | R-CBCC-N3 | S-MSFM-P3 | S-MSFM-P3 |
| Number of components | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | 3 | 3 | 3 |
| Maximum operating temperature | 200 °C | 200 °C | 200 °C | 200 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | METAL | METAL |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | FLANGE MOUNT | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Polarity/channel type | NPN | NPN | NPN | NPN |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | NO | NO |
| Terminal form | NO LEAD | NO LEAD | PIN/PEG | PIN/PEG |
| Terminal location | BOTTOM | BOTTOM | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON |
| Nominal transition frequency (fT) | 30 MHz | 30 MHz | 30 MHz | 30 MHz |