• Transformer Coupled Across 70 ohms, Measured on Stub:
• BU-63147/157XX-XX0
• BU-63147X3-XX2 (Note 9)
Output Noise, Differential (Direct Coupled)
Output Offset Voltage, Transformer Coupled Across 70 ohms
Rise/Fall Time
• BU-63147/157X3
• BU-63147X4
LOGIC
V
IH
V
IL
I
IH
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
I
IL
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
V
OH
(Vcc=4.75V,I
OH
=max)
V
OL
(Vcc=4.75V,I
OH
=max)
I
OL
I
OH
6
18
20
-250
100
200
7
20
22
150
150
250
9
27
27
10
250
300
300
Vp-p
Vp-p
Vp-p
mVp-p, diff
mVp-p, diff
ns
ns
2.0
20
-100
2.4
0.4
3.4
-3.4
0.8
100
-20
V
V
µA
µA
V
V
mA
mA
POWER SUPPLY REQUIREMENTS
Voltages/Tolerances
• +5V
Current Drain (Total Hybrid)
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
4.75
5.0
80
199
286
455
80
210
308
500
5.25
100
229
348
535
100
240
370
580
V
mA
mA
mA
mA
mA
mA
mA
mA
Data Device Corporation
www.ddc-web.com
3
BU-63147
P-07/12-0
TABLE 1. BU-63147/157 SPECIFICATIONS (CONT.)
PARAMETER
POWER DISSIPATION (NOTE 10)
Total Hybrid
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
Hottest Die
BU-63147/157/XX-XX0
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
THERMAL
• Thermal Resistance, Junction-to-Case, Hottest Die (θ
JC
)
• Operating Junction Temperature
• Storage Temperature
• Lead Temperature (soldering, 10 sec.)
PHYSICAL CHARACTERISTICS
Size
36-Pin DIP
36-Lead Flat pack
Weight
MIN
TYP
MAX
UNITS
0.4
0.65
0.73
0.88
0.4
0.7
0.84
1.1
0.2
0.43
0.59
0.78
0.2
0.48
0.7
1.00
0.5
0.8
1.04
1.28
0.5
0.85
1.15
1.50
0.25
0.6
0.84
1.13
0.25
0.65
0.95
1.35
12
150
150
+300
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
°C/W
°C
°C
°C
-55
-65
1.900 x .800 x .205
(48.26 x 20.32 x 5.21)
1.900 x .800 x .200
(48.26 x 20.32 x 5.08)
0.6
(17)
in.
(mm)
in.
(mm)
oz
(g)
Notes:
Notes 1 through 6 are applicable to the Receiver Differential Resistance and Differential Capacitance specifications:
(1) Specifications include both transmitter and receiver (assumed tied together externally).
(2) Impedance parameters are specified directly between pins TX/RX A(B) and TX/RX A(B) hybrid.
(3) It is assumed that all power and ground inputs to the hybrid are connected and that the hybrid case is connected to ground for the impedance measurement.
(4) The specifications are applicable for both unpowered and powered conditions.
(5) The specifications assume a 2 volt rms balanced, differential, sinusoidal input. The applicable frequency range is 75 kHz to 1 MHz.
(6) Minimum resistance and maximum capacitance parameters are guaranteed over the operating range, but are not tested.
(7) The Threshold Level, as referred to in this specification, is meant to be the maximum peak-to-peak voltage (measured on the data bus) that can be applied to the
receiver's input without causing the output to change from the OFF state.
(8) Assumes a common mode voltage within the frequency range of dc to 2 MHz, applied to pins of the isolation transformer on the stub side (either direct or transformer
coupled), and referenced to transceiver ground. Transformer must be a DDC recommended transformer or other transformer that provides an equivalent minimum
CMRR.
(9) MIL-STD-1760 requires minimum output voltage of 20 Vp-p on the stub connection. The -XX2 option is
not
available for the BU-63147X4 or BU-63157 versions.
(10) Power dissipation specifications assume a transformer coupled configuration, with external dissipation (while transmitting) of 0.14 watts for the active isolation trans-
former, 0.08 watts for the active coupling transformer, 0.45 watts for each of the two bus isolation resistors, and 0.15 watts for each of the two bus termination resistors.
(11) Assuming the use of isolation transformers with the turns ratios shown in Figure 3 and in the absence of common mode signal on the 1553 stub, this equates to a
nominal stub voltage of 38 Volts
PK-to-PK
transformer-coupled, or 53 Volts
PK-to-PK
direct-coupled.
Data Device Corporation
www.ddc-web.com
4
BU-63147
P-07/12-0
TABLE 2. BU-63157 RADIATION SPECIFICATIONS*
PART NUMBER
BU-63157X3
TOTAL DOSE
100 KRAD
SINGLE EVENT
LATCHUP
IMMUNE
INTRODUCTION
The BU-63147/157 is a dual redundant transmitter and receiver
packaged in a 36-pin DDIP or flat pack. It is directly compatible to
Harris 15530 encoder/decoder and has internal (factory preset)
threshold levels. The dual transceiver only requires +5V power
and conforms to MIL-STD-1553A and 1553B. For McAir compat-
ibility, versions are available with rise/fall times of 200 to 300
nsec.
Figure 3 illustrates the connection between a BU-63147/157
transceiver and a MIL-STD-1553 Data Bus. After transformer
isolating the transceiver, it can be either direct coupled (short
stub) or transformer coupled (long stub) to the Data Bus.
*Note: Radiation parameters specified on this data sheet are derived from initial
qualification testing by DDC and published data from ASIC manufacturers. These
devices have not been evaluated for compliance to the RHA requirements stipu-
lated in MIL-PRF-38534, Appendix G.
TABLE 3. HIGH RELIABILITY SCREENING OPTIONS
FOR BU-63157
ELEMENT EVALUATION
Visual Inspection:
Integrated Circuits
Transistor & Diodes
Passive Components
METHOD
TRANSMIT OPERATING MODE
MIL-STD-883, Method 2010 Condition A
MIL-STD-750, Method 2072 and 2073
MIL-STD-883, Method 2032 Class S
SEM Analysis for Integrated MIL-STD-883, Method 2018
Circuits
Element Evaluation:
Visual, Electrical, Wire
Bondability, 24-Hour
Stabilization Bake, 10
Temperature Cycles,
5000 g’s constant accelera-
tion, 240-Hour Powered
Burn-In and 1000-Hour Life
Test (Burn-In and 1000-
Hour Life Test are Only
Required for Active
Components.)
ASSEMBLY & TEST
Particle Impact Noise
Detection (PIND)
320-Hour Burn-In
(Standard on this device)
100% Non-Destructive
Wirebond Pull
(Standard on this device)
Radiographic (X-Ray)
Analysis
QCI TESTING
Extended Temperature
Cycling:
20 Cycles Including
Radiographic (X-Ray)
Testing
Moisture Content Limit of
5000 PPM
MIL-STD-883, Method 2020
Condition A
MIL-STD-883, Method 1015
The transmitter section accepts encoded TTL data and converts
it to phase-modulated bipolar form using a waveshaping network
and driver circuits. The driver outputs TX DATA OUT and TX DATA
OUT are transformer coupled to the Data Bus.
The transmitter output terminals can be put into a high imped-
ance state by setting INHIBIT high, or setting TX DATA IN and TX
DATA IN to the same logic level. The operating modes are shown
in TABLE 4.
The transceivers are able to operate in a “wraparound” mode.
This allows output data to be monitored by the receiver section
and returned to the decoder where it is checked for errors.
MIL-PRF-38534
TABLE 4. TRANSMIT OPERATING MODE
TX DATA IN
X
0
0
MIL-STD-883, Method 2023
1
1
MIL-STD-883, Method 2012
TX DATA IN
X
0
1
0
1
TX INHIBIT
H
X
L
L
X
DRIVER OUTPUT
OFF (NOTE)
OFF
TX DATA OUT ON,
TX DATA OUT OFF
TX DATA OUT ON,
TX DATA OUT OFF
OFF
NOTE: DRIVER OUTPUT terminals are in the high impedance mode during
I am looking forward to getting a Renesas board! Thank you to the website staff for creating so many learning opportunities for the majority of netizens! Thank you....
In practical application circuits, in order to increase the input resistance of the inverting input proportional operation circuit, the T-type resistor network in the circuit shown in the figure is of...
The company has a mature architecture, but it has problems for me. Originally, LCLK was directly given by an external crystal oscillator. I entered the FPGA and then gave the 9054 chip through the FPG...
Millimeter waves usually refer to electromagnetic waves with a frequency band of 30~300GHz and a corresponding wavelength of 1~10mm. The operating frequency is between microwaves and far infrared wave...
As far as I understand, ChipWatcher should only allow one clock source to be selected. However, in actual use, it seems that even after selecting multiple ones, there is only one in the end. In this c...
Store 20 data consecutively at RAM30H, move them to 50H, store and count the total number of 05H in the data block. How to do it in assembly~~Thanks for your advice~~...
On August 24th, Tesla CEO Elon
Musk
revealed information about the upcoming FSD V14, claiming it will outperform human drivers. Tesla FSD lead Ashok stated last year that FSD version 12.5, ...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
To enable real-time monitoring of home security and automatically dial a number for voice prompts or send text messages when an alarm occurs, a GPRS-based embedded telephone alarm system was design...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
Recently, AstroBo Robot, a subsidiary of Chenxing Automation, launched a new mobile collaborative palletizing product. Leveraging an omnidirectional mobile chassis, an intelligent scheduling system...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
1. Ease of Use: The HMI module should be designed to be simple and clear, allowing users to easily operate and configure the energy storage device.
2. Ease of Maintenance: The HMI module should...[Details]
On August 22, according to CNBC's report today, the National Highway Traffic Safety Administration (NHTSA) is launching an investigation into Tesla, and the latter is questioned whether it has fail...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
Previously, Positive Motion Technology shared with you the firmware upgrade of motion controller, ZBasic program development, ZPLC program development, communication with touch screen and input/out...[Details]
introduction
In recent years, multi-touch has emerged as a new alternative to traditional human-computer interaction. It eliminates the need for keyboards and mice, enabling simultaneous inter...[Details]
Renesas Electronics MCUs
京公网安备 11010802033920号
EEWORLD
