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BCM4330XKUBG

Description
Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,168 Pages
ManufacturerBroadcom
Environmental Compliance
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BCM4330XKUBG Overview

Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133

BCM4330XKUBG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionVFBGA, BGA133,12X12,16
Reach Compliance Codecompliant
JESD-30 codeR-PBGA-B133
length5.33 mm
Humidity sensitivity level1
Number of functions1
Number of terminals133
Maximum operating temperature85 °C
Minimum operating temperature-30 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA133,12X12,16
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
power supply3.6 V
Certification statusNot Qualified
Maximum seat height0.55 mm
Nominal supply voltage1.2 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
width4.89 mm
Base Number Matches1
Preliminary Data Sheet
BCM4330
Single Chip IEEE 802.11™ a/b/g/n MAC/Baseband/
Radio with Integrated Bluetooth® 4.0 + HS and FM
Transceiver
GE N ER A L DE S CR I P TI O N
The Broadcom® BCM4330 single chip device provides
for the highest level of integration for a mobile or
handheld wireless system, with integrated
IEEE 802.11™ a/b/g and single-stream 802.11n
(MAC/baseband/radio), Bluetooth® 4.0 + HS, and FM
radio receiver and transmitter. It includes on-chip
2.4 GHz and 5 GHz WLAN CMOS power amplifiers
that meet the output power requirements of most
handheld systems while permitting an optional
external power amplifier for higher output power
applications, if required.
Utilizing advanced design techniques and process
technology to reduce active and idle power, the
BCM4330 is designed to address the needs of highly
mobile devices that require minimal power
consumption and compact size. It includes a power
management unit which simplifies the system power
topology and allows for operation directly from a
mobile platform battery while maximizing battery
life.
VIO
F E A T U RE S
The BCM4330 implements the highly sophisticated
Enhanced Collaborative Coexistence radio
coexistence algorithms and hardware mechanisms,
allowing for an extremely collaborative Bluetooth
coexistence scheme along with coexistence support
for external radios (such as GPS, WiMax, or Ultra
Wide-band radio technologies, as well as cellular
radios) and a single shared antenna (2.4 GHz antenna
for Bluetooth and WLAN). As a result, enhanced
overall quality for simultaneous voice, video, and
data transmission on a handheld system is achieved.
For the WLAN section, two alternative host interface
options are included: an SDIO v2.0 interface that can
operate in 4b, 1b, or gSPI modes, and an HSIC
interface. An independent, high-speed UART is
provided for the Bluetooth host interface. Package
options include 4.89 mm x 5.33 mm WLBGA and
WLCSP, and 6.5 mm x 6.5 mm FCFBGA.
Vbatt
WL_RESETx
BCM4330
WLAN
Host I/F
WL_IRQ
SDIO*/SPI
HSIC
CLK_REQ
BT_RESETx
5 GHz WLAN Tx
5 GHz WLAN Rx
T/R Switch or FEM
Bluetooth
Host I/F
UART
I
2
S/PCM
BT_WAKEUP
UART_WAKEUP
UART
I2S_DO/PCM_OUT (FM Rx)
2.4 GHz WLAN Tx
2.4 GHz WLAN/BT Rx
Bluetooth Tx
FM TX/RX
Host I/F
I2S_DI/PCM_IN (FM Tx)
I2S_WS/PCM_SYNC (FM Rx/Tx)
I2S_CK/PCM_CLK (FM Rx/Tx)
Analog Audio Out
SP3T Switch
CBF
FM Tx
FM Rx
Figure 1: Functional Block Diagram
4330-DS206-R
5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203
10/9/2011 7T5YL
Free Datasheet http://www.nDatasheet.com
August 17, 2011

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Description Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133 Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133 Telecom Circuit, 1-Func, PBGA225, 4.89 X 5.33 MM, 0.20 MM PITCH, WLCSP-225 Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133 Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133 Telecom Circuit, 1-Func, PBGA225, 4.89 X 5.33 MM, 0.20 MM PITCH, WLCSP-225 Telecom Circuit, 1-Func, PBGA144, 6.50 X 6.50 MM, 0.50 MM PITCH, MS-034, FCFBGA-144
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
package instruction VFBGA, BGA133,12X12,16 VFBGA, BGA133,12X12,16 VFBGA, BGA225(UNSPEC) VFBGA, BGA133,12X12,16 VFBGA, BGA133,12X12,16 VFBGA, BGA225(UNSPEC) VFBGA, BGA144,12X12,20
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
Base Number Matches 1 1 1 1 1 1 1
JESD-30 code R-PBGA-B133 - R-PBGA-B225 R-PBGA-B133 - R-PBGA-B225 S-PBGA-B144
length 5.33 mm - 5.33 mm 5.33 mm - 5.33 mm 6.5 mm
Number of functions 1 - 1 1 - 1 1
Number of terminals 133 - 225 133 - 225 144
Maximum operating temperature 85 °C - 85 °C 85 °C - 85 °C 85 °C
Minimum operating temperature -30 °C - -30 °C -30 °C - -30 °C -30 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA - VFBGA VFBGA - VFBGA VFBGA
Encapsulate equivalent code BGA133,12X12,16 - BGA225(UNSPEC) BGA133,12X12,16 - BGA225(UNSPEC) BGA144,12X12,20
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR - RECTANGULAR SQUARE
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
power supply 3.6 V - 3.6 V 3.6 V - 3.6 V 3.6 V
Certification status Not Qualified - Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 0.55 mm - 0.41 mm 0.55 mm - 0.41 mm 1 mm
Nominal supply voltage 1.2 V - 1.2 V 1.2 V - 1.2 V 1.2 V
surface mount YES - YES YES - YES YES
Telecom integrated circuit types TELECOM CIRCUIT - TELECOM CIRCUIT TELECOM CIRCUIT - TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level OTHER - OTHER OTHER - OTHER OTHER
Terminal form BALL - BALL BALL - BALL BALL
Terminal location BOTTOM - BOTTOM BOTTOM - BOTTOM BOTTOM
width 4.89 mm - 4.89 mm 4.89 mm - 4.89 mm 6.5 mm

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