BCM4330GKUBG datasheet, PDF - EEWORLD Datasheet

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BCM4330GKUBG: DescriptionTelecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133; CategoryWireless rf/communication Telecom circuit; File Size3MB，168 Pages; ManufacturerBroadcom; Environmental Compliance

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BCM4330GKUBG Overview

Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133

BCM4330GKUBG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	VFBGA, BGA133,12X12,16
Reach Compliance Code	compliant
JESD-30 code	R-PBGA-B133
length	5.33 mm
Number of functions	1
Number of terminals	133
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA133,12X12,16
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
power supply	3.6 V
Certification status	Not Qualified
Maximum seat height	0.55 mm
Nominal supply voltage	1.2 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
width	4.89 mm
Base Number Matches	1

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Preliminary Data Sheet

BCM4330

Single Chip IEEE 802.11™ a/b/g/n MAC/Baseband/

Radio with Integrated Bluetooth® 4.0 + HS and FM

Transceiver

GE N ER A L DE S CR I P TI O N

The Broadcom® BCM4330 single chip device provides

for the highest level of integration for a mobile or

handheld wireless system, with integrated

IEEE 802.11™ a/b/g and single-stream 802.11n

(MAC/baseband/radio), Bluetooth® 4.0 + HS, and FM

radio receiver and transmitter. It includes on-chip

2.4 GHz and 5 GHz WLAN CMOS power amplifiers

that meet the output power requirements of most

handheld systems while permitting an optional

external power amplifier for higher output power

applications, if required.

Utilizing advanced design techniques and process

technology to reduce active and idle power, the

BCM4330 is designed to address the needs of highly

mobile devices that require minimal power

consumption and compact size. It includes a power

management unit which simplifies the system power

topology and allows for operation directly from a

mobile platform battery while maximizing battery

life.

VIO

F E A T U RE S

The BCM4330 implements the highly sophisticated

Enhanced Collaborative Coexistence radio

coexistence algorithms and hardware mechanisms,

allowing for an extremely collaborative Bluetooth

coexistence scheme along with coexistence support

for external radios (such as GPS, WiMax, or Ultra

Wide-band radio technologies, as well as cellular

radios) and a single shared antenna (2.4 GHz antenna

for Bluetooth and WLAN). As a result, enhanced

overall quality for simultaneous voice, video, and

data transmission on a handheld system is achieved.

For the WLAN section, two alternative host interface

options are included: an SDIO v2.0 interface that can

operate in 4b, 1b, or gSPI modes, and an HSIC

interface. An independent, high-speed UART is

provided for the Bluetooth host interface. Package

options include 4.89 mm x 5.33 mm WLBGA and

WLCSP, and 6.5 mm x 6.5 mm FCFBGA.

Vbatt

WL_RESETx

BCM4330

WLAN

Host I/F

WL_IRQ

SDIO*/SPI

HSIC

CLK_REQ

BT_RESETx

5 GHz WLAN Tx

5 GHz WLAN Rx

T/R Switch or FEM

Bluetooth

Host I/F

UART

S/PCM

BT_WAKEUP

UART_WAKEUP

UART

I2S_DO/PCM_OUT (FM Rx)

2.4 GHz WLAN Tx

2.4 GHz WLAN/BT Rx

Bluetooth Tx

FM TX/RX

Host I/F

I2S_DI/PCM_IN (FM Tx)

I2S_WS/PCM_SYNC (FM Rx/Tx)

I2S_CK/PCM_CLK (FM Rx/Tx)

Analog Audio Out

SP3T Switch

CBF

FM Tx

FM Rx

Figure 1: Functional Block Diagram

4330-DS206-R

5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203

10/9/2011 7T5YL

Free Datasheet http://www.nDatasheet.com

August 17, 2011

BCM4330GKUBG Related Products

	BCM4330GKUBG	BCM4330FKUBG	BCM4330XKUBG	BCM4330FKWBG	BCM4330SB2KUBG	BCM4330XKWBG	BCM4330FB2KFFBG
Description	Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133	Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133	Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133	Telecom Circuit, 1-Func, PBGA225, 4.89 X 5.33 MM, 0.20 MM PITCH, WLCSP-225	Telecom Circuit, 1-Func, PBGA133, 4.89 X 5.33 MM, 0.40 MM PITCH, MO-225, WLBGA-133	Telecom Circuit, 1-Func, PBGA225, 4.89 X 5.33 MM, 0.20 MM PITCH, WLCSP-225	Telecom Circuit, 1-Func, PBGA144, 6.50 X 6.50 MM, 0.50 MM PITCH, MS-034, FCFBGA-144
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	VFBGA, BGA133,12X12,16	VFBGA, BGA133,12X12,16	VFBGA, BGA133,12X12,16	VFBGA, BGA225(UNSPEC)	VFBGA, BGA133,12X12,16	VFBGA, BGA225(UNSPEC)	VFBGA, BGA144,12X12,20
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Base Number Matches	1	1	1	1	1	1	1
JESD-30 code	R-PBGA-B133	-	R-PBGA-B133	R-PBGA-B225	-	R-PBGA-B225	S-PBGA-B144
length	5.33 mm	-	5.33 mm	5.33 mm	-	5.33 mm	6.5 mm
Number of functions	1	-	1	1	-	1	1
Number of terminals	133	-	133	225	-	225	144
Maximum operating temperature	85 °C	-	85 °C	85 °C	-	85 °C	85 °C
Minimum operating temperature	-30 °C	-	-30 °C	-30 °C	-	-30 °C	-30 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	-	VFBGA	VFBGA	-	VFBGA	VFBGA
Encapsulate equivalent code	BGA133,12X12,16	-	BGA133,12X12,16	BGA225(UNSPEC)	-	BGA225(UNSPEC)	BGA144,12X12,20
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
power supply	3.6 V	-	3.6 V	3.6 V	-	3.6 V	3.6 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	0.55 mm	-	0.55 mm	0.41 mm	-	0.41 mm	1 mm
Nominal supply voltage	1.2 V	-	1.2 V	1.2 V	-	1.2 V	1.2 V
surface mount	YES	-	YES	YES	-	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	-	TELECOM CIRCUIT	TELECOM CIRCUIT	-	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	OTHER	-	OTHER	OTHER	-	OTHER	OTHER
Terminal form	BALL	-	BALL	BALL	-	BALL	BALL
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM
width	4.89 mm	-	4.89 mm	4.89 mm	-	4.89 mm	6.5 mm

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