Product Specification Bulletin
Surface Mount Tip & Ring Ceramic Chip Capacitors
KEMET’s 250 VDC or Tip & Ring MLCC capacitors are designed and rated for telecommunication ringer cir-
cuits where the capacitor is used to block -48 to -52 Volt DC of line voltage and pass a 16-25 Hz AC signal pulse
of 70 Vrms to 90 Vrms. The surface mount ceramic capacitors are excellent replacements for high voltage leaded
film devices. The smaller SMT footprints save valuable board space which is critical when creating new designs,
and the capacitors are able to withstand today’s higher lead-free reflow processing temperatures. The ceramic
MLCC have excellent high frequency filtering characteristics, low ESR, and high temperature reflow capabilities.
KEMET Tip and Ring capacitors are available in standard EIA case sizes and standard capacitance values from
0.001μF to 1.2μF. The capacitors have pure tin (100% Matte Sn) plated terminations and are 100% lead free which
is ideal for new environmentally demanding designs.
Applications:
• Telecommunication Ringing Circuits
• Switch Mode Power Supply Snubber Circuits
• High Voltage DC Blocking
• High Voltage Coupling
Markets:
• Phone Lines
• Analog and Digital Modems
• FAX Machines
•
Wireless Base Stations, Ethernet
• Digital Video Recording Set-Top Boxes
• Satellite Dish
• Cable Set-Top Boxes
• High Voltage Power Supply, DC/DC Converters
• Ethernet, POS, ATM Hardware
Outline Drawing
W
T
S
ELECTRODES
L
B
NICKEL PLATE
CONDUCTIVE METALLIZATION
TIN PLATE
Table 1 – Dimensions - Millimeters (Inches)
Metric Code
2012
3216
3225
4532
4564
5650
5664
EIA Size Code
0805
1206
1210
1812
1825
2220
2225
L - Length
2.0 (0.079)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
4.5 (0.177)
± 0.3 (0.012)
4.5 (0.177)
± 0.3 (0.012)
5.6 (0.224)
± 0.4 (0.016)
5.6 (0.224)
± 0.4 (0.016)
W - Width
1.2 (0.049
± 0.2 (0.008)
1.6 (0.063)
± 0.2 (0.008)
2.5 (0.098)
± 0.2 (0.008)
3.2 (0.126)
± 0.3 (0.012)
6.4 (0.250)
± 0.4 (0.016)
5.0 (0.197)
± 0.4 (0.016)
6.4 (0.250)
± 0.4 (0.016)
B - Bandwidth
0.5 (0.02)
± 0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
Band Separation
0.75 (0.030)
N/A
N/A
N/A
N/A
N/A
N/A
Note: For thickness dimensions, see Table 2.
F-9033D 11/07
Capacitor Ordering Information
C
Style
C - Ceramic
Size Code
0805, 1206, 1210, 1812, 1825, 2220, 2225
0805
C
103
K
A
R
A
C
End Metallization
C = 100% Sn Std.
Failure Rate Level
A = Not Applicable
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
Voltage
A = 250V
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
Capacitance Tolerance
J = ±5%, K = ±10%, M = ±20%
General Performance Characteristics & Electrical Parameters 250 VDC
EIA Case Sizes
Capacitance Range
Test Parameters
Operating Temperature Range
Temperature Characteristic
Capacitance Tolerances
Dissipation Factor
Aging Rate
Voltage Rating
25°C IR @ Rated Voltage
Dielectric Strength (DMV)
0805, 1206, 1210, 1812, 1825, 2220, 2225
0.001μF to 1.2μF
Capacitance and Dissipation Factor measured at 1.0 ± 0.2 Vrms and 1.0 ± 0.2 kHz
-55°C to +125°C
-55°C to +125°C X7R: ±15% (0% VDC)
J = ±5%, K = ±10%, M = ±20%
≤2.5%
2.5% per decade hour
250 VDC
1000MΩ−μF or 100GΩ, whichever is less
250% of Rated Voltage 5 ± 1 seconds and charge/discharge not exceeding 50mA
These chips are supplied unmarked. If required, they can be laser-marked as an extra cost option. Details on the
marking format are included in KEMET Surface Mount Catalog F3102 on page 96.
The 0805 and 1206 sizes are suitable for either reflow or wave soldering. Sizes 1210 and larger should be limited
to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of pure nickel with an overplating
of pure tin for excellent solderability and resistance to leaching of the termination.
KEMET High Voltage Surface Mount MLCC capacitors are available packaged in tape and reel configuration.
Marking
Soldering Process
Packaging
Recommended Solder Pad Dimensions
T - Total Length S - Separation
Chip Size
mm
0805
1206
1210
1812
1825
2220
2225
3.30
4.50
4.50
5.90
5.90
7.00
7.00
in.
0.130
0.177
0.177
0.232
0.232
0.276
0.276
mm
0.70
1.50
1.50
2.30
2.30
3.30
3.30
in.
0.028
0.059
0.059
0.091
0.091
0.130
0.130
mm
1.60
2.00
2.90
3.70
6.90
5.50
6.80
in.
0.063
0.079
0.114
0.146
0.272
0.217
0.268
mm
1.30
1.50
1.50
1.80
1.80
1.85
1.85
in.
0.051
0.059
0.059
0.071
0.071
0.073
0.073
W - Pad Width L - Pad Length
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • (864) 963-6300 • www.kemet.com
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