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MCIMX515DVK8C

Description
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA625
Categorysemiconductor    The embedded processor and controller   
File Size2MB,184 Pages
ManufacturerFREESCALE (NXP)
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MCIMX515DVK8C Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PBGA625

MCIMX515DVK8C Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals625
Maximum operating temperature85 Cel
Minimum operating temperature-20 Cel
Maximum supply/operating voltage1.15 V
Minimum supply/operating voltage1.05 V
Rated supply voltage1.1 V
Processing package description13 X 13 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-625
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
packaging shapeSQUARE
Package SizeGRID ARRAY, LOW PROFILE, FINE PITCH
surface mountYes
Terminal formBALL
Terminal spacing0.5000 mm
terminal coatingTIN SILVER COPPER
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Temperature levelOTHER
Microprocessor typeMICROPROCESSOR CIRCUIT
Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX51CEC
Rev. 1, 11/2009
IMX51
i.MX51 Applications
Processors for Consumer and
Industrial Products
Package Information
Plastic Package
Case 2058 13 x 13 mm, 0.5 mm pitch
Case 2017 19 x 19 mm, 0.8 mm pitch
Ordering Information
See
Table 1
on page 3 for ordering information.
1
Introduction
1
The i.MX51 multimedia applications processors
represent Freescale Semiconductor’s latest addition to a
growing family of multimedia-focused products offering
high performance processing optimized for lowest
power consumption.
The i.MX51 processors feature Freescale’s advanced
and power-efficient implementation of the ARM Cortex
A8™ core, which operates at speeds as high as
800 MHz. Up to 200 MHz DDR2 and mobile DDR
DRAM clock rates are supported. These devices are
suitable for applications such as the following:
• Netbooks (web tablets)
• Nettops (internet desktop devices)
• Mobile internet devices (MID)
• Portable media players (PMP)
• Portable navigation devices (PND)
• High-end PDAs
• Gaming consoles
• Automotive navigation and entertainment (see
automotive data sheet, IMX51AEC)
2
3
4
5
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Special Signal Considerations. . . . . . . . . . . . . . . . 12
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 14
3.2 Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4 Output Buffer Impedance Characteristics . . . . . . . 28
3.5 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31
3.6 Module Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.7 External Peripheral Interfaces . . . . . . . . . . . . . . . . 60
Package Information and Contact Assignments . . . . . . 137
4.1 13
×
13 mm Package Information . . . . . . . . . . . . 137
4.2 19
×
19 mm Package Information . . . . . . . . . . . . 156
4.3 13
×
13 mm, 0.5 Pitch Ball Map . . . . . . . . . . . . . 174
4.4 19 x 19 mm, 0.8 Pitch Ball Map. . . . . . . . . . . . . . 179
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Preliminary—Subject to Change Without Notice
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MCIMX512DVK8C, MCIMX513DVK8C, MCIMX515DVK8C, and

MCIMX515DVK8C Related Products

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Description SPECIALTY MICROPROCESSOR CIRCUIT, PBGA625 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 625 529 529 529 529 529 529 529
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
Minimum operating temperature -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel
Maximum supply/operating voltage 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V
Minimum supply/operating voltage 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V
Rated supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Processing package description 13 X 13 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-625 19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529 19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529 19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529 19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529 19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529 19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529 19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529
Lead-free Yes Yes Yes Yes Yes Yes Yes Yes
EU RoHS regulations Yes Yes Yes Yes Yes Yes Yes Yes
China RoHS regulations Yes Yes Yes Yes Yes Yes Yes Yes
state ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
packaging shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package Size GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
surface mount Yes Yes Yes Yes Yes Yes Yes Yes
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal spacing 0.5000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm
terminal coating TIN SILVER COPPER tin silver copper tin silver copper tin silver copper tin silver copper tin silver copper tin silver copper tin silver copper
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Packaging Materials PLASTIC/EPOXY Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy
Temperature level OTHER other other other other other other other
Microprocessor type MICROPROCESSOR CIRCUIT microprocessor circuit microprocessor circuit microprocessor circuit microprocessor circuit microprocessor circuit microprocessor circuit microprocessor circuit
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