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CMLM0584TR

Description
Transistor
CategoryDiscrete semiconductor    The transistor   
File Size658KB,2 Pages
ManufacturerCentral Semiconductor
Download Datasheet Parametric View All

CMLM0584TR Overview

Transistor

CMLM0584TR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSingle
Maximum drain current (Abs) (ID)0.45 A
FET technologyMETAL-OXIDE SEMICONDUCTOR
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Polarity/channel typeP-CHANNEL
Maximum power dissipation(Abs)0.35 W
surface mountYES
Base Number Matches1
CMLM0584
Multi Discrete Module
w w w. c e n t r a l s e m i . c o m
SURFACE MOUNT SILICON
P-CHANNEL MOSFET AND
LOW VF SCHOTTKY DIODE
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMLM0584
is a Multi Discrete Module™ consisting of a single
P-Channel Enhancement-mode MOSFET and a
Low VF Schottky diode packaged in a space saving
PICOmini™ SOT-563 surface mount case. This
device is designed for small signal general purpose
applications where size and operational efficiency are
prime requirements.
MARKING CODE: 58C
SOT-563 CASE
• Device is
Halogen Free
by design
FEATURES:
• ESD protection up to 2kV
• Low rDS(on) Transistor (1.5Ω MAX @ VGS=2.5V)
• Low VF Schottky Diode (0.47V MAX @ 0.5A)
SYMBOL
PD
PD
PD
TJ, Tstg
Θ
JA
SYMBOL
VDS
VGS
ID
SYMBOL
VRRM
IF
IFRM
IFSM
350
300
150
-65 to +150
357
UNITS
mW
mW
mW
°C
°C/W
UNITS
V
V
mA
UNITS
V
mA
A
A
APPLICATIONS:
• DC / DC Converters
• Battery Powered Portable Equipment
MAXIMUM RATINGS - CASE:
(TA=25°C)
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Power Dissipation (Note 3)
Operating and Storage Junction Temperature
Thermal Resistance
MAXIMUM RATINGS - Q1:
(TA=25°C)
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
MAXIMUM RATINGS - D1:
(TA=25°C)
Peak Repetitive Reverse Voltage
Continuous Forward Current
Peak Repetitive Forward Current, tp≤1.0ms
Peak Forward Surge Current, tp= 8.0ms
30
8.0
450
40
500
3.5
10
ELECTRICAL CHARACTERISTICS - Q1:
(TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
TYP
IGSSF, IGSSR VGS=8.0V, VDS=0
IDSS
VDS=30V, VGS=0
BVDSS
VGS=0, ID=100μA
30
VGS(th)
VDS=VGS, ID=250μA
0.5
VSD
VGS=0, IS=100mA
0.5
VGS=4.5V, ID=430mA
rDS(ON)
rDS(ON)
VGS=2.5V, ID=200mA
rDS(ON)
VGS=1.8V, ID=100mA
gFS
VDS =10V, ID=100mA
200
Notes:
(1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm
2
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm
2
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm
2
MAX
3.0
1.0
1.0
1.1
1.1
2.0
3.3
UNITS
μA
μA
V
V
V
Ω
Ω
Ω
mS
R2 (2-August 2011)
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