CX29704-13 datasheet, PDF - EEWORLD Datasheet

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CX29704-13: DescriptionATM/SONET/SDH IC, CMOS, PBGA272,; CategoryWireless rf/communication Telecom circuit; File Size2MB，212 Pages; ManufacturerCONEXANT; Websitehttp://www.conexant.com/

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CX29704-13 Overview

ATM/SONET/SDH IC, CMOS, PBGA272,

CX29704-13 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	BGA, BGA272,20X20,50
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B272
JESD-609 code	e0
Number of terminals	272
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA272,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
power supply	3.3 V
Certification status	Not Qualified
Maximum slew rate	683 mA
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Base Number Matches	1

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OptiPHY™-F155 STS-3/STM-1 SONET/

SDH ATM/POS Framer Family

Data Sheet

CX29704 Four STS-3/STM-1 Ports

CX29702 Two STS-3/STM-1 Ports

CX29701 One STS-3/STM-1 Port

500034C

July 2002

-Continued from Front-

The CX2970x LVPECL line interface provides a simple interface to industry standard optical transceiver modules. The integrated

clock and data recovery and transmit synthesis circuits are compliant with Bellcore GR-253 jitter standards. In the transmit

direction the SONET/SDH framers generate all section, line, and path overhead bytes in addition to implementing framing,

scrambling and alarm indication functions. On the receive path, all framing, descrambling, alarm detection, and pointer

processing is performed. A serial interface inserts and extracts the section or line DCC bytes. The CX2970x has complete set of

ATM cell processing functions including: cell encapsulation, HEC calculation, cell delineation, payload scrambling/descrambling

and idle cell insertion/filtering. The POS processing features of the CX2970x include: HDLC framing, scrambling/descrambling,

interframe fills, FIFO management and stuffing/destuffing operations. For both ATM and POS applications a combined Utopia

Level 2/POS Level 2 16-bit interface operates at 50 MHz to support a maximum throughput of 800 Mb/s.

Software for the CX2970x is available on the Mindspeed web site and includes the CX2970x Telecom Application Package (TAP)

and the CX28299 Automatic Protection Switching (APS) software. The CX2970x TAP software is compliant with telecom

standards and includes device initialization code, configuration and diagnostic parameters, and support for failure and

performance monitoring according to applicable telecom standards. A debug monitor can optionally be compiled to assist in

initial hardware debugging. The CX28299 APS software supports linear 1+1, linear 1:n, and Unidirectional Path Switched Rings

(UPSR). The CX28299 APS software utilizes the bridging and switching features of the CX2970x family to implement a complete

physical layer APS solution that is transparent to the ATM/Link layer devices.

An evaluation module (EVM) is available from Mindspeed that demonstrates the features of the CX2970x family of devices. The

CX2904-CN8237 ATM/POS EVM includes the Mindspeed CX29704 ATM/POS PHY and the Mindspeed CN8237 ATM SAR

devices along with four optical transceiver modules in a standard PCI form factor card that can be used with most PC

motherboards. The POS system interface is accessible through two 50-pin connectors. Customers can accelerate their time-to-

market by using the evaluation module as a way to become familiar with the device. For complete EVM details including

schematics, board layout, and bill of material information, see the Mindspeed web site.

Data Sheet

Mindspeed Technologies

™

500034C

CX29704-13 Related Products

	CX29704-13	CX29702-13	CX29701-13
Description	ATM/SONET/SDH IC, CMOS, PBGA272,	ATM/SONET/SDH IC, CMOS, PBGA272,	ATM/SONET/SDH IC, CMOS, PBGA272,
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50
Reach Compliance Code	compliant	compliant	compliant
JESD-30 code	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272
JESD-609 code	e0	e0	e0
Number of terminals	272	272	272
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA
Encapsulate equivalent code	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	683 mA	630 mA	612 mA
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
Maker	-	CONEXANT	CONEXANT

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