NAND01GR4B2BZA6F datasheet, PDF

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NAND01GR4B2BZA6F: Description128M X 8 FLASH 1.8V PROM, 25000 ns, PBGA63; Categorystorage storage; File Size1MB，60 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com

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NAND01GR4B2BZA6F Overview

128M X 8 FLASH 1.8V PROM, 25000 ns, PBGA63

NAND01GR4B2BZA6F Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	9 X 11 MM, 1 MM HEIGHT, 0.80 PITCH, ROHS COMPLIANT, VFBGA-63
Contacts	63
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	25000 ns
JESD-30 code	R-PBGA-B63
JESD-609 code	e1
length	11 mm
memory density	1073741824 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	63
word count	67108864 words
character code	64000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1.05 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	9 mm
Base Number Matches	1

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NAND01G-B2B

NAND02G-B2C

1-Gbit, 2-Gbit,

2112-byte/1056-word page, 1.8 V/3 V, NAND flash memory

Features

■

High density NAND flash memories

– Up to 2 Gbits of memory array

– Cost effective solutions for mass storage

applications

NAND interface

– x8 or x16 bus width

– Multiplexed address/ data

– Pinout compatibility for all densities

Supply voltage: 1.8 V/3.0 V

Page size

– x8 device: (2048 + 64 spare) bytes

– x16 device: (1024 + 32 spare) words

Block size

– x8 device: (128 K + 4 K spare) bytes

– x16 device: (64 K + 2 K spare) words

Page read/program

– Random access: 25 µs (max)

– Sequential access: 30 ns (min)

– Page program time: 200 µs (typ)

Copy back program mode

Cache program and cache read modes

Fast block erase: 2 ms (typ)

Status register

Electronic signature

Chip enable ‘don’t care’

■

TSOP48 12 x 20 mm

FBGA

■

VFBGA63 9.5 x 12 x 1 mm

VFBGA63 9 x 11 x 1 mm

■

Serial number option

Data protection

– Hardware block locking

– Hardware program/erase locked during

power transitions

Data integrity

– 100 000 program/erase cycles per block

(with ECC)

– 10 years data retention

ECOPACK

packages

Development tools

– Error correction code models

– Bad blocks management and wear leveling

algorithms

– Hardware simulation models

■

Table 1.

Device summary

Reference

NAND01G-B2B

Part number

NAND01GR3B2B, NAND01GW3B2B

NAND01GR4B2B

NAND01GW4B2B

(1)

NAND02GR3B2C, NAND02GW3B2C

NAND02G-B2C

NAND02GR4B2C, NAND02GW4B2C

(1)

1. x16 organization only available for MCP products.

April 2008

Rev 5

1/60

www.numonyx.com

Contents

NAND01G-B2B, NAND02G-B2C

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Memory array organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.1

Bad blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Signals description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

Inputs/outputs (I/O0-I/O7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Inputs/outputs (I/O8-I/O15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Address Latch Enable (AL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Command Latch Enable (CL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Enable (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write Protect (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Ready/Busy (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1

4.2

4.3

4.4

4.5

4.6

Command input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Address input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Data output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Device operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.1

Read memory array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.1.1

6.1.2

Random read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Page read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2/60

NAND01G-B2B, NAND02G-B2C

Contents

6.2

6.3

Cache read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Page program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.3.1

6.3.2

Sequential input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Random data input in a page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.4

6.5

6.6

6.7

6.8

Copy back program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Cache program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Block erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Read status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

Write protection bit (SR7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

P/E/R controller and cache ready/busy bit (SR6) . . . . . . . . . . . . . . . . . 30

P/E/R controller bit (SR5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Cache program error bit (SR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Error bit (SR0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

SR4, SR3 and SR2 are reserved . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

6.9

Read electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Data protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Software algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

8.1

8.2

8.3

8.4

8.5

8.6

Bad block management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

NAND flash memory failure modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Garbage collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Wear-leveling algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Error correction code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Hardware simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

8.6.1

8.6.2

Behavioral simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

IBIS simulations models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Program and erase times and endurance cycles . . . . . . . . . . . . . . . . . 39

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

11.1

11.2

Ready/Busy signal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . 52

Data protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

3/60

NAND01G-B2B, NAND02G-B2C

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Valid blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Address insertion, x8 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Address insertion, x16 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Address definitions, x8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Address definitions, x16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Copy back program x8 addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Copy back program x16 addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Status register bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Electronic signature byte 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Electronic signature byte/word 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

NAND flash failure modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Program, erase times and program erase endurance cycles . . . . . . . . . . . . . . . . . . . . . . . 39

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

DC characteristics, 1.8 V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

DC characteristics, 3 V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

AC characteristics for command, address, data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

AC characteristics for operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package mechanical data. . . . . 55

VFBGA63 9.5 x 12 mm - 6 x 8 ball array, 0.80 mm pitch, package mechanical data. . . . . 56

VFBGA63 9 x 11 mm - 6 x 8 active ball array, 0.80 mm pitch, package mechanical data . 57

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

5/60

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