IC,LOGIC MUX,DUAL,4-INPUT,LS-TTL,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | MULTIPLEXER |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DM74LS353J/A+ | 54LS353FMQB | 54LS353DMQB | DM74LS353N/A+ | |
|---|---|---|---|---|
| Description | IC,LOGIC MUX,DUAL,4-INPUT,LS-TTL,DIP,16PIN,CERAMIC | LS SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 | LS SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16 | IC,LOGIC MUX,DUAL,4-INPUT,LS-TTL,DIP,16PIN,PLASTIC |
| package instruction | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T16 | R-GDFP-F16 | R-GDIP-T16 | R-PDIP-T16 |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| Number of functions | 2 | 2 | 2 | 2 |
| Number of entries | 4 | 4 | 4 | 4 |
| Number of terminals | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | DFP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |