IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DFP, FL20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | MULTIPLEXER |
| MaximumI(ol) | 0.016 A |
| Number of functions | 1 |
| Number of entries | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL20,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Maximum supply current (ICC) | 33 mA |
| Prop。Delay @ Nom-Sup | 43 ns |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DM8211W | DM8210J | DM8210W | DM8211J | DM8211N | DM7210J | DM7210W | DM7211J | DM7211W | |
|---|---|---|---|---|---|---|---|---|---|
| Description | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,PLASTIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant | unknown | unknown | unknown |
| JESD-30 code | R-XDFP-F20 | R-XDIP-T20 | R-XDFP-F20 | R-XDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | R-XDIP-T20 | R-XDFP-F20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| MaximumI(ol) | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of entries | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DFP | DIP | DIP | DIP | DFP | DIP | DFP |
| Encapsulate equivalent code | FL20,.3 | DIP20,.3 | FL20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | DIP20,.3 | FL20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK |
| Maximum supply current (ICC) | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA |
| Prop。Delay @ Nom-Sup | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | YES | NO | NO | NO | YES | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| package instruction | DFP, FL20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | - | DFP, FL20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
京公网安备 11010802033920号
EEWORLD
