DPS3232V-100C datasheet, PDF - EEWORLD Datasheet

DPS3232V-100C: DescriptionSRAM Module, 128KX8, 100ns, CMOS, CPGA66, CERAMIC, PGA-66; Categorystorage storage; File Size161KB，7 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS3232V-100C Overview

SRAM Module, 128KX8, 100ns, CMOS, CPGA66, CERAMIC, PGA-66

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	PGA, PGA66,11X11
Contacts	66
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
Other features	USER CONFIGURABLE AS 32K X 32
I/O type	COMMON
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
length	27.3 mm
memory density	1048576 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	7.62 mm
Maximum standby current	0.004 A
Minimum standby current	2 V
Maximum slew rate	0.56 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	27.3 mm
Base Number Matches	1

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