DG200M/D datasheet, PDF - EEWORLD Datasheet

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DG200M/D: DescriptionSPST, 2 Func, CMOS; CategoryAnalog mixed-signal IC The signal circuit; File Size209KB，4 Pages; ManufacturerGeneral Electric Solid State

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DG200M/D Overview

SPST, 2 Func, CMOS

DG200M/D Parametric

Parameter Name	Attribute value
package instruction	, DIE OR CHIP
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	SPST
Nominal Negative Supply Voltage (Vsup)	-15 V
normal position	NC
Number of functions	2
Maximum operating temperature	25 °C
Minimum operating temperature	25 °C
output	SEPARATE OUTPUT
Encapsulate equivalent code	DIE OR CHIP
power supply	+-15 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	15 V
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	OTHER
Base Number Matches	1

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DG200M/D Related Products

	DG200M/D	DG200BA	DG200AK/883B	DG200AA	DG200AA/883B	DG200AK/HR
Description	SPST, 2 Func, CMOS	SPST, 2 Func, CMOS, MBCY10,	SPST, 2 Func, CMOS, CDIP14,	SPST, 2 Func, CMOS, MBCY10,	SPST, 2 Func, CMOS, MBCY10,	SPST, 2 Func, CMOS, CDIP14
package instruction	, DIE OR CHIP	, CAN10,.23	DIP, DIP14,.3	, CAN10,.23	, CAN10,.23	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SPST	SPST	SPST	SPST	SPST	SPST
Nominal Negative Supply Voltage (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
normal position	NC	NC	NC	NC	NC	NC
Number of functions	2	2	2	2	2	2
Maximum operating temperature	25 °C	85 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	25 °C	-25 °C	-55 °C	-55 °C	-55 °C	-55 °C
output	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT
Encapsulate equivalent code	DIE OR CHIP	CAN10,.23	DIP14,.3	CAN10,.23	CAN10,.23	DIP14,.3
power supply	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	MILITARY	MILITARY	MILITARY	MILITARY
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	-	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State
JESD-30 code	-	O-MBCY-W10	R-XDIP-T14	O-MBCY-W10	O-MBCY-W10	R-XDIP-T14
JESD-609 code	-	e0	e0	e0	e0	e0
Number of terminals	-	10	14	10	10	14
Package body material	-	METAL	CERAMIC	METAL	METAL	CERAMIC
Package shape	-	ROUND	RECTANGULAR	ROUND	ROUND	RECTANGULAR
Package form	-	CYLINDRICAL	IN-LINE	CYLINDRICAL	CYLINDRICAL	IN-LINE
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	WIRE	THROUGH-HOLE	WIRE	WIRE	THROUGH-HOLE
Terminal location	-	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL

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