SPST, 2 Func, CMOS, MBCY10,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | General Electric Solid State |
| package instruction | , CAN10,.23 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | O-MBCY-W10 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NC |
| Number of functions | 2 |
| Number of terminals | 10 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| output | SEPARATE OUTPUT |
| Package body material | METAL |
| Encapsulate equivalent code | CAN10,.23 |
| Package shape | ROUND |
| Package form | CYLINDRICAL |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 15 V |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | WIRE |
| Terminal location | BOTTOM |
| DG200AA/883B | DG200BA | DG200M/D | DG200AK/883B | DG200AA | DG200AK/HR | |
|---|---|---|---|---|---|---|
| Description | SPST, 2 Func, CMOS, MBCY10, | SPST, 2 Func, CMOS, MBCY10, | SPST, 2 Func, CMOS | SPST, 2 Func, CMOS, CDIP14, | SPST, 2 Func, CMOS, MBCY10, | SPST, 2 Func, CMOS, CDIP14 |
| package instruction | , CAN10,.23 | , CAN10,.23 | , DIE OR CHIP | DIP, DIP14,.3 | , CAN10,.23 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| normal position | NC | NC | NC | NC | NC | NC |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 125 °C | 85 °C | 25 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -25 °C | 25 °C | -55 °C | -55 °C | -55 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Encapsulate equivalent code | CAN10,.23 | CAN10,.23 | DIE OR CHIP | DIP14,.3 | CAN10,.23 | DIP14,.3 |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | OTHER | OTHER | MILITARY | MILITARY | MILITARY |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible | incompatible |
| Maker | General Electric Solid State | General Electric Solid State | - | General Electric Solid State | General Electric Solid State | General Electric Solid State |
| JESD-30 code | O-MBCY-W10 | O-MBCY-W10 | - | R-XDIP-T14 | O-MBCY-W10 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
| Number of terminals | 10 | 10 | - | 14 | 10 | 14 |
| Package body material | METAL | METAL | - | CERAMIC | METAL | CERAMIC |
| Package shape | ROUND | ROUND | - | RECTANGULAR | ROUND | RECTANGULAR |
| Package form | CYLINDRICAL | CYLINDRICAL | - | IN-LINE | CYLINDRICAL | IN-LINE |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | WIRE | WIRE | - | THROUGH-HOLE | WIRE | THROUGH-HOLE |
| Terminal location | BOTTOM | BOTTOM | - | DUAL | BOTTOM | DUAL |