D Latch, 1-Func, 8-Bit, TTL, PDSO24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | SOP, SOP24,.4 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G24 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D LATCH |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP24,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| N74F412DB | N74F412D-T | N74F412D | N74F412N-B | N74F412N | |
|---|---|---|---|---|---|
| Description | D Latch, 1-Func, 8-Bit, TTL, PDSO24 | D Latch, 1-Func, 8-Bit, TTL, PDSO24 | D Latch, 1-Func, 8-Bit, TTL, PDSO24 | D Latch, 1-Func, 8-Bit, TTL, PDIP24 | D Latch, 1-Func, 8-Bit, TTL, PDIP24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| Number of digits | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | DIP | DIP |
| Encapsulate equivalent code | SOP24,.4 | SOP24,.4 | SOP24,.4 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | - |
| MaximumI(ol) | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| Maximum supply current (ICC) | - | 60 mA | 60 mA | 60 mA | 60 mA |
| Prop。Delay @ Nom-Sup | - | 18.5 ns | 18.5 ns | 18.5 ns | 18.5 ns |
| Certification status | - | Not Qualified | Not Qualified | - | Not Qualified |
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