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N74F412N

Description
D Latch, 1-Func, 8-Bit, TTL, PDIP24
Categorylogic    logic   
File Size463KB,9 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

N74F412N Overview

D Latch, 1-Func, 8-Bit, TTL, PDIP24

N74F412N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP24,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T24
JESD-609 codee0
Logic integrated circuit typeD LATCH
MaximumI(ol)0.024 A
Number of digits8
Number of functions1
Number of terminals24
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Maximum supply current (ICC)60 mA
Prop。Delay @ Nom-Sup18.5 ns
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

N74F412N Related Products

N74F412N N74F412D-T N74F412D N74F412N-B N74F412DB
Description D Latch, 1-Func, 8-Bit, TTL, PDIP24 D Latch, 1-Func, 8-Bit, TTL, PDSO24 D Latch, 1-Func, 8-Bit, TTL, PDSO24 D Latch, 1-Func, 8-Bit, TTL, PDIP24 D Latch, 1-Func, 8-Bit, TTL, PDSO24
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP24,.3 SOP, SOP24,.4 SOP, SOP24,.4 DIP, DIP24,.3 SOP, SOP24,.4
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T24 R-PDSO-G24 R-PDSO-G24 R-PDIP-T24 R-PDSO-G24
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type D LATCH D LATCH D LATCH D LATCH D LATCH
Number of digits 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 24 24 24 24 24
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP DIP SOP
Encapsulate equivalent code DIP24,.3 SOP24,.4 SOP24,.4 DIP24,.3 SOP24,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE
power supply 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES NO YES
technology TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1
MaximumI(ol) 0.024 A 0.024 A 0.024 A 0.024 A -
Maximum supply current (ICC) 60 mA 60 mA 60 mA 60 mA -
Prop。Delay @ Nom-Sup 18.5 ns 18.5 ns 18.5 ns 18.5 ns -
Certification status Not Qualified Not Qualified Not Qualified - -
Maker - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.)
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