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7038L20PFGI

Description
TQFP-100, Tray
Categorystorage    storage   
File Size478KB,19 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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7038L20PFGI Overview

TQFP-100, Tray

7038L20PFGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeTQFP
package instructionLFQFP, QFP100,.63SQ,20
Contacts100
Manufacturer packaging codePNG100
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Samacsys DescriptionTQFP 14.0 X 14.0 X 1.4 MM
Maximum access time20 ns
I/O typeCOMMON
JESD-30 codeS-PQFP-G100
JESD-609 codee3
length14 mm
memory density1179648 bit
Memory IC TypeDUAL-PORT SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of ports2
Number of terminals100
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP100,.63SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.003 A
Minimum standby current4.5 V
Maximum slew rate0.36 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
Base Number Matches1
HIGH-SPEED
64K x 18 DUAL-PORT
STATIC RAM
Features
7038L
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial: 15ns (max.)
– Industrial: 20ns (max.)
Low-power operation
– IDT7038L
Active: 1W (typ.)
Standby: 1mW (typ.)
Dual chip enables allow for depth expansion without
external logic
IDT7038 easily expands data bus width to 36 bits or
more using the Master/Slave select when cascading more
than one device
M/S = V
IH
for
BUSY
output flag on Master,
M/S = V
IL
for
BUSY
input on Slave
Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
Separate upper-byte and lower-byte controls for multi-
plexed bus and bus matching compatibility
TTL-compatible, single 5V (±10%) power supply
Available in a 100-pin TQFP
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
R/
W
L
UB
L
CE
0L
CE
1L
OE
L
LB
L
R/
W
R
UB
R
CE
0R
CE
1R
OE
R
LB
R
I/O
9-17L
I/O
0-8L
BUSY
L
A
15L
A
0L
(1,2)
I/O
9-17R
I/O
Control
I/O
Control
I/O
0-8R
BUSY
R
64Kx18
MEMORY
ARRAY
7038
16
16
(1,2)
.
Address
Decoder
Address
Decoder
A
15R
A
0R
CE
0L
CE
1L
OE
L
R/W
L
SEM
L
INT
L
(2)
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
0R
CE
1R
OE
R
R/W
R
SEM
R
(2)
INT
R
4837 drw 01
M/S
(1)
NOTES:
1.
BUSY
is an input as a Slave (M/S = V
IL
) and an output when it is a Master (M/S = V
IH
).
2.
BUSY
and
INT
are non-tri-state totem-pole outputs (push-pull).
JUNE 2019
DSC-4837/7
1

7038L20PFGI Related Products

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Description TQFP-100, Tray TQFP-100, Reel TQFP-100, Tray TQFP-100, Reel TQFP-100, Tray TQFP-100, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to conform to incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code TQFP TQFP TQFP TQFP TQFP TQFP
package instruction LFQFP, QFP100,.63SQ,20 LFQFP, QFP100,.63SQ,20 LFQFP, QFP100,.63SQ,20 LFQFP, QFP100,.63SQ,20 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Contacts 100 100 100 100 100 100
Manufacturer packaging code PNG100 PNG100 PNG100 PNG100 PN100 PN100
Reach Compliance Code compliant compliant compliant compliant not_compliant not_compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 20 ns 15 ns 15 ns 20 ns 20 ns 20 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609 code e3 e3 e3 e3 e0 e0
length 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
memory density 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 18 18 18 18 18 18
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of ports 2 2 2 2 2 2
Number of terminals 100 100 100 100 100 100
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 70 °C 85 °C
organize 64KX18 64KX18 64KX18 64KX18 64KX18 64KX18
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
Encapsulate equivalent code QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 240 240
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum standby current 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A 0.003 A
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.36 mA 0.34 mA 0.34 mA 0.36 mA 0.3 mA 0.36 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 30 30 20 20
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 1 1 1
Samacsys Description TQFP 14.0 X 14.0 X 1.4 MM TQFP 14.0 X 14.0 X 1.4 MM TQFP 14.0 X 14.0 X 1.4 MM TQFP 14.0 X 14.0 X 1.4 MM - -

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