7038L20PFI datasheet, PDF - EEWORLD Datasheet

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7038L20PFI: DescriptionTQFP-100, Tray; Categorystorage storage; File Size478KB，19 Pages; ManufacturerIDT (Integrated Device Technology)

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7038L20PFI Overview

TQFP-100, Tray

7038L20PFI Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	TQFP
package instruction	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Contacts	100
Manufacturer packaging code	PN100
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	20 ns
Other features	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
I/O type	COMMON
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
memory density	1179648 bit
Memory IC Type	DUAL-PORT SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	100
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.003 A
Minimum standby current	4.5 V
Maximum slew rate	0.36 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm
Base Number Matches	1

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HIGH-SPEED

64K x 18 DUAL-PORT

STATIC RAM

Features

◆

7038L

◆

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Commercial: 15ns (max.)

– Industrial: 20ns (max.)

Low-power operation

– IDT7038L

Active: 1W (typ.)

Standby: 1mW (typ.)

Dual chip enables allow for depth expansion without

external logic

IDT7038 easily expands data bus width to 36 bits or

more using the Master/Slave select when cascading more

than one device

◆

M/S = V

for

BUSY

output flag on Master,

M/S = V

for

BUSY

input on Slave

Interrupt Flag

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

Separate upper-byte and lower-byte controls for multi-

plexed bus and bus matching compatibility

TTL-compatible, single 5V (±10%) power supply

Available in a 100-pin TQFP

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Green parts available, see ordering information

Functional Block Diagram

I/O

9-17L

I/O

0-8L

BUSY

15L

(1,2)

I/O

9-17R

I/O

Control

I/O

Control

I/O

0-8R

BUSY

64Kx18

MEMORY

ARRAY

7038

(1,2)

Address

Decoder

Address

Decoder

15R

R/W

SEM

INT

(2)

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

R/W

SEM

(2)

INT

4837 drw 01

M/S

(1)

NOTES:

BUSY

is an input as a Slave (M/S = V

) and an output when it is a Master (M/S = V

BUSY

and

INT

are non-tri-state totem-pole outputs (push-pull).

JUNE 2019

DSC-4837/7

7038L20PFI Related Products

	7038L20PFI	7038L15PFG8	7038L15PFG	7038L20PFGI8	7038L20PFGI	7038L20PF
Description	TQFP-100, Tray	TQFP-100, Reel	TQFP-100, Tray	TQFP-100, Reel	TQFP-100, Tray	TQFP-100, Tray
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Lead free	Lead free	Lead free	Lead free	Contains lead
Is it Rohs certified?	incompatible	conform to	conform to	conform to	conform to	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	TQFP	TQFP	TQFP	TQFP	TQFP	TQFP
package instruction	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Contacts	100	100	100	100	100	100
Manufacturer packaging code	PN100	PNG100	PNG100	PNG100	PNG100	PN100
Reach Compliance Code	not_compliant	compliant	compliant	compliant	compliant	not_compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	20 ns	15 ns	15 ns	20 ns	20 ns	20 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e0	e3	e3	e3	e3	e0
length	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
memory density	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	18	18	18	18	18	18
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2
Number of terminals	100	100	100	100	100	100
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C
organize	64KX18	64KX18	64KX18	64KX18	64KX18	64KX18
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	260	260	260	260	240
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.36 mA	0.34 mA	0.34 mA	0.36 mA	0.36 mA	0.3 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	20	30	30	30	30	20
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Base Number Matches	1	1	1	1	1	1
Samacsys Description	-	TQFP 14.0 X 14.0 X 1.4 MM	TQFP 14.0 X 14.0 X 1.4 MM	TQFP 14.0 X 14.0 X 1.4 MM	TQFP 14.0 X 14.0 X 1.4 MM	-

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