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R5F3650RDFB Overview

RENESAS MCU

R5F3650RDFB Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeQFP
package instructionLFQFP, QFP100,.63SQ,20
Contacts100
Reach Compliance Codecompli
ECCN code3A991.A.2
Has ADCYES
Address bus width20
bit size32
CPU seriesM16C
maximum clock frequency32 MHz
DAC channelYES
DMA channelYES
External data bus width16
JESD-30 codeS-PQFP-G100
length14 mm
Number of I/O lines85
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP100,.63SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
power supply3/5 V
Certification statusNot Qualified
RAM (bytes)48128
rom(word)655360
ROM programmabilityFLASH
Maximum seat height1.7 mm
speed32 MHz
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
width14 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
M16C/65 Group
RENESAS MCU
REJ03B0257-0110
Rev.1.10
Sep 24, 2009
1.
1.1
Overview
Features
The M16C/65 Group microcomputer (MCU) incorporates the M16C/60 Series CPU core and flash
memory, employing sophisticated instructions for a high level of efficiency. This MCU has 1 MB of address
space (expandable to 4 MB), and it is capable of executing instructions at high speed. In addition, the
CPU core boasts a multiplier for high-speed operation processing.
This MCU consumes low power, and supports operating modes that allow additional power control. The
MCU also uses an anti-noise configuration to reduce emissions of electromagnetic noise and is designed
to withstand electromagnetic interference (EMI). By integrating many of the peripheral functions, including
the multifunction timer and serial interface, the number of system components has been reduced.
1.1.1
Applications
This MCU can be used in audio components, cameras, televisions, household appliances, office
equipment, communication devices, mobile devices, industrial equipment, and other applications.
REJ03B0257-0110 Rev.1.10 Sep 24, 2009
Page 1 of 109
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