EEPROM, 8KX8, 300ns, Parallel, NMOS, 1.490 X 0.610 INCH, 0.232 INCH HEIGHT, DIP-28
| Parameter Name | Attribute value |
| Maker | Defense Logistics Agency |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 300 ns |
| JESD-30 code | R-XDIP-T28 |
| memory density | 65536 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 8KX8 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | NMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Maximum write cycle time (tWC) | 10 ms |
| Base Number Matches | 1 |
| 5962-8683003XA | 5962-8683006YA | 5962-8683007XA | 5962-8683004YA | |
|---|---|---|---|---|
| Description | EEPROM, 8KX8, 300ns, Parallel, NMOS, 1.490 X 0.610 INCH, 0.232 INCH HEIGHT, DIP-28 | EEPROM, 8KX8, 250ns, Parallel, MOS, CQCC32 | EEPROM, 8KX8, 350ns, Parallel, MOS, CDIP28 | EEPROM, 8KX8, 250ns, Parallel, NMOS, 0.560 X 0.458 INCH, 0.120 INCH HEIGHT, LCC-32 |
| package instruction | DIP, | QCCN, LCC32,.45X.55 | DIP, DIP28,.6 | QCCN, |
| Reach Compliance Code | unknown | unknow | unknown | unknown |
| Maximum access time | 300 ns | 250 ns | 350 ns | 250 ns |
| JESD-30 code | R-XDIP-T28 | R-XQCC-N32 | R-XDIP-T28 | R-XQCC-N32 |
| memory density | 65536 bit | 65536 bi | 65536 bit | 65536 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 32 | 28 | 32 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Package body material | UNSPECIFIED | CERAMIC | CERAMIC | UNSPECIFIED |
| encapsulated code | DIP | QCCN | DIP | QCCN |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES |
| technology | NMOS | MOS | MOS | NMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | QUAD | DUAL | QUAD |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 1 ms |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Maker | Defense Logistics Agency | - | Defense Logistics Agency | Defense Logistics Agency |