REVISIONS
LTR
A
DESCRIPTION
Change to Table I, parameter t
SCT
. Correction to vendor similar part
number. Editorial changes throughout.
Changes in accordance with NOR 5962-R088-92.
Boilerplate update, part of 5-year review. ksr
Update drawing to meet current MIL-PRF-38535 requirements. – glg
DATE (YR-MO-DA)
90-01-08
APPROVED
Michael A. Frye
B
C
D
91-12-13
10-04-23
17-07-21
Michael A. Frye
Charles F. Saffle
Charles Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Kenneth S. Rice
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles Reusing
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-01-12
AMSC N/A
MICROCIRCUIT, MEMORY, DIGITAL,
512 X 8 BIT NONVOLATILE STATIC
RAM, MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
REVISION LEVEL
D
67268
1 OF
14
5962-87712
5962-E477-17
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87712
01
X_
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
2004
2004
Circuit function
512 x 8 bit, nonvolatile static RAM
512 x 8 bit, nonvolatile static RAM
Access time
250 ns
300 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
GDIP1-T28 and CDIP2-T28
CQCC1-N32
Terminals
28
32
Package style
dual-in-line package
rectangular chip carrier package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Temperature under bias - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Storage temperature- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Voltage on any pin with respect to ground - - - - - - - - - - - - - - - - - - - - -
DC output current - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Lead temperature (soldering, 10 seconds)- - - - - - - - - - - - - - - - - - - - -
Power dissipation (P
D
) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Thermal resistance, junction-to-case (θ
JC
)- - - - - - - - - - - - - - - - - - - - -
Junction temperature (T
J
) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
1.4 Recommended operating conditions.
Supply voltage (V
CC
) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Minimum high level input voltage (V
IH
)- - - - - - - - - - - - - - - - - - - - - - - -
Maximum high level input voltage (V
IH
) - - - - - - - - - - - - - - - - - - - - - - -
Minimum low level input voltage (V
IL
) - - - - - - - - - - - - - - - - - - - - - - - -
Maximum low level input voltage (V
IL
) - - - - - - - - - - - - - - - - - - - - - - - -
Case operating temperature range (T
C
) - - - - - - - - - - - - - - - - - - - - - - -
4.5 V dc to 5.5 V dc
+2.3 V dc
+V
CC
+ 0.5 V dc
-0.5 V dc
+0.8 V dc
-55ºC to +125ºC
-65ºC to +135ºC
-65ºC to +150ºC
-1.0 V to +7.0 V dc
5.0 mA
300ºC
0.75 W
See MIL-STD-1835
200ºC
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87712
SHEET
D
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil/
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-
38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table. The truth table shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-87712
SHEET
D
3
FPGA/CPLD
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