5962-9559506HAA datasheet, PDF

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5962-9559506HAA: DescriptionSRAM Module, 128KX32, 45ns, CMOS, CQFP68, CERAMIC, QFP-68; Categorystorage storage; File Size1MB，13 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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5962-9559506HAA Overview

SRAM Module, 128KX32, 45ns, CMOS, CQFP68, CERAMIC, QFP-68

5962-9559506HAA Parametric

Parameter Name	Attribute value
Maker	Micross
Parts packaging code	QFP
package instruction	QFP, QFP68,.99SQ,50
Contacts	68
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	45 ns
Other features	ALSO CONFIGURABLE AS 512K X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	S-CQFP-G68
JESD-609 code	e0
length	22.352 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Encapsulate equivalent code	QFP68,.99SQ,50
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Minimum standby current	2 V
Maximum slew rate	0.6 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
width	22.352 mm
Base Number Matches	1

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AS8S128K32

128K x 32 SRAM

SRAM MEMORY ARRAY

AVAILABLE AS MILITARY SPECIFICATIONS

• SMD 5962-95595 (-Q); SMD 5962-93187 (-P or -PN);

MIL-STD-883

SRAM

GENERAL DESCRIPTION

8, 21, 28, 39 are no connects (PN

66 Lead PGA- Pins

The AS8S128K32 is a 4 Megabit CMOS SRAM Module or-

ganized as 128Kx32-bits and user configurable to 256Kx16 or

512Kx8. The AS8S128K32 achieves high speed access, low

power consumption and high reliability by employing advanced

CMOS memory technology.

The military temperature grade product is suited for military

applications.

The AS8S128K32 is offered in a ceramic quad flatpack module

per SMD-5962-95595 with a maximum height of 0.140 inches.

FEATURES

• Operation with single 5V supply • Built in decoupling caps for

• 2V Data Retention, Low power

low noise operation

standby

• Organized as 128K x32; User

• Vastly improved Icc Specs

configured as 256Kx16 or

• Access times of 12, 15, 17, 20,

512K x8

25, 35, and 45 ns

• TTL Compatible Inputs and

• Low power CMOS

Outputs

AS8S128K32

CE4

WE4

SRAM

OPTIONS

Timing

12ns

15ns

17ns

20ns

Markings

-12

-15

-17

-20

Timing

25ns

35ns

45ns

Markings

-25

-35

-45

128K x 8

PIN ASSIGNMENT

(Top View)

PIN ASSIGNMENT

(Top View)

Package

Ceramic Quad Flatpack

Pin Grid Array -8 Series

on pins 8, 21,

Markings

28, 39

Q (No. 702); Q1

ASSIGNMENT

(No. 802); PN* (No. 802)

AS8S128K32

*No connect

SRAM

AS8S128K32

SRAM

68 Lead CQFP

(Q & Q1)

66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)

66 Lead

PGA- Pins 8,

21, 28, 39 are

grounds (P)

66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)

66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)

Vcc

A11

A12

A13

A14

A15

A16

CS2\

OE\

CS4\

I/O 0

I/O 1

I/O 2

I/O 3

I/O 4

I/O

GND

I/O 8

I/O

I/O 11

I/O 12

I/O 13

I/O 14

I/O

CS1\

GND

CS3\

WE\

A10

Vcc

Lead CQFP (Q & Q1)

This device is also offered

in a 1.075 inch square

ceramic pin grid array per

SMD 5692-93187, which

has a maximum height of

0.195 inches. This pack-

age is also a low profile,

multi-chip module design

reducing height require-

ments to a minimum.

CE3

WE3

128K x 8

I/O 24 - I/O 31

I/O 16 - I/O 23

I/O 8 - I/O 23

makes use of

This module

ASSIGNMENT

(Top View)

a low profile, mutlichip

module design.

CQFP (Q & Q1)

68 Lead

CE2

WE2

CE1

WE1

A0 - 16

I/O 0 - I/O 7

66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)

I/O 16

I/O 17

I/O 18

I/O 19

I/O 20

I/O 21

I/O 22

I/O 23

GND

I/O 24

I/O 25

I/O 26

I/O 27

I/O 28

I/O 29

I/O 30

I/O 31

68 Lead

CQFP

(BQFP)

Military SMD

Pinout Option

66 Lead

PGA- Pins 8,

21, 28, 39 are

no connects

(PN)

66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)

CE3

WE3

128K x 8

AS8S128K32

Rev. 4.5 08/13

66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)

CE4

Micross

WE4

Components reserves the right to change products or specifications without notice.

I/O 24 - I/O 31

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