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74HCT2G00DP

Description
NAND Gate
Categorylogic    logic   
File Size312KB,15 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HCT2G00DP Overview

NAND Gate

74HCT2G00DP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNexperia
package instructionTSSOP-8
Reach Compliance Codecompliant
seriesHCT
JESD-30 codeS-PDSO-G8
JESD-609 codee4
length3 mm
Logic integrated circuit typeNAND GATE
Humidity sensitivity level1
Number of functions2
Number of entries2
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)29 ns
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm
Base Number Matches1
Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename
Nexperia.
Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use
http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com
(email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
-
© Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via
salesaddresses@nexperia.com).
Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia

74HCT2G00DP Related Products

74HCT2G00DP 2225B473M251LBAR 700925.420.5 DBP-M998-03-5901-FF 935274813125 74HCT2G00DC 74HCT2G00GD 935274812125
Description NAND Gate Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.047uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT Fixed Resistor, Wire Wound, 0.25W, 5.42ohm, 200V, 0.5% +/-Tol, -2,2ppm/Cel, Array/Network Resistor, Bussed, Tantalum Nitride/nickel Chrome, 0.1W, 5900ohm, 100V, 1% +/-Tol, -25,25ppm/Cel, 8726, NAND Gate NAND Gate NAND Gate NAND Gate
Is it Rohs certified? conform to conform to incompatible incompatible conform to conform to conform to conform to
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
Number of terminals 8 2 2 16 8 8 8 8
Maximum operating temperature 125 °C 125 °C 145 °C 150 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -55 °C -65 °C -55 °C -40 °C -40 °C -40 °C -40 °C
Package shape SQUARE RECTANGULAR PACKAGE TUBULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
package instruction TSSOP-8 , - - VSSOP, VSSOP, VSON, VSSOP,
series HCT - 7000(AXIAL) - HCT HCT HCT HC/UH
JESD-30 code S-PDSO-G8 - - - R-PDSO-G8 R-PDSO-G8 R-PDSO-N8 R-PDSO-G8
JESD-609 code e4 - - - e4 e4 e4 e4
length 3 mm - - - 2.3 mm 2.3 mm 3 mm 2.3 mm
Logic integrated circuit type NAND GATE - - - NAND GATE NAND GATE NAND GATE NAND GATE
Humidity sensitivity level 1 - - - 1 1 1 1
Number of functions 2 - - - 2 2 2 2
Number of entries 2 - - - 2 2 2 2
Package body material PLASTIC/EPOXY - - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP - - - VSSOP VSSOP VSON VSSOP
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Axial DIP SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 29 ns - - - 29 ns 29 ns 29 ns 110 ns
Maximum seat height 1.1 mm - - - 1 mm 1 mm 0.5 mm 1 mm
Maximum supply voltage (Vsup) 5.5 V - - - 5.5 V 5.5 V 5.5 V 6 V
Minimum supply voltage (Vsup) 4.5 V - - - 4.5 V 4.5 V 4.5 V 2 V
Nominal supply voltage (Vsup) 5 V - - - 5 V 5 V 5 V 5 V
surface mount YES NO - - YES YES YES YES
technology CMOS - WIRE WOUND TANTALUM NITRIDE/NICKEL CHROME CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE - - - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) - - - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING - - - GULL WING GULL WING NO LEAD GULL WING
Terminal pitch 0.65 mm - - - 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL - - - DUAL DUAL DUAL DUAL
width 3 mm - - - 2 mm 2 mm 2 mm 2 mm

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