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S1M

Description
1 A, 1000 V, SILICON, SIGNAL DIODE, DO-214AC
Categorysemiconductor    Discrete semiconductor   
File Size186KB,2 Pages
ManufacturerSEMTECH_ELEC
Websitehttp://www.semtech.net.cn
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S1M Overview

1 A, 1000 V, SILICON, SIGNAL DIODE, DO-214AC

S1M Parametric

Parameter NameAttribute value
Number of terminals2
Number of components1
Processing package descriptionPlastic, SMA, 2 PIN
Lead-freeYes
EU RoHS regulationsYes
stateDISCONTINUED
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formC BEND
terminal coatingtin/silver
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
structuresingle
Diode component materialssilicon
Diode typeSignal diode
Maximum repetitive peak reverse voltage1000 V
Maximum average forward current1 A
S1A THRU S1M
SURFACE MOUNT GENERAL RECTIFIER
Reverse Voltage – 50 to 1000 V
Forward Current – 1 A
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• Glass passivated chip junction
• For surface mount application
• Low profile package
• Built-in strain relief, ideal for automated placement
Mechanical Data
Case:
SMA (DO-214AC), molded plastic
Terminals:
Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Absolute Maximum Ratings and Characteristics
Ratings at 25
O
C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Symbols S1A S1B S1D S1G S1J S1K S1M Units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
Peak Forward Surge Current , 8.3 ms Single Half
Sine-wave Superimposed on Rated Load (JEDEC
Method)
Maximum Forward Voltage at 1 A
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Typical Junction Capacitance
at V
R
= 4 V, f = 1 MHz
Typical Thermal Resistance
1)
Operating and Storage Temperature Range
1)
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
50
35
50
100
70
100
200
140
200
400
280
400
1
30
1.1
5
50
12
75
27
600
420
600
800
560
800
1000
700
1000
V
V
V
A
A
V
μA
pF
O
at T
A
= 25
O
C
at T
A
= 125
O
C
I
R
C
J
R
θ
JA
R
θ
JL
T
J
, T
S
C/W
O
- 55 to +1 50
C
Thermal resistance from junction to ambient from junction to lead mounted on P.C.B. with 0.2 X 0.2" (5 X 5 mm) copper pad
areas
SEMTECH ELECTRONICS LTD.
(Subsidiary
of Sino-Tech International Holdings Limited, a company
listed on the Hong Kong Stock Exchange, Stock Code: 724)
®
Dated : 14/04/2008

S1M Related Products

S1M S1A S1D S1B S1G S1J S1K
Description 1 A, 1000 V, SILICON, SIGNAL DIODE, DO-214AC 1 A, 50 V, SILICON, SIGNAL DIODE, DO-214AA SIGNAL DIODE 1 A, 100 V, SILICON, SIGNAL DIODE, DO-214AC 1 A, 400 V, SILICON, SIGNAL DIODE 1 A, 600 V, SILICON, SIGNAL DIODE, DO-214AC 1 A, 800 V, SILICON, SIGNAL DIODE, DO-214AC
Number of terminals 2 2 - 2 2 2 -
Number of components 1 1 - 1 1 1 -
Processing package description Plastic, SMA, 2 PIN ROHS COMPLIANT, PLASTIC, SMB, 2 PIN - GREEN, PLASTIC, SMA, 2 PIN - GREEN, PLASTIC, SMA, 2 PIN -
Lead-free Yes Yes - Yes - Yes -
EU RoHS regulations Yes Yes - Yes - Yes -
state DISCONTINUED ACTIVE ACTIVE ACTIVE DISCONTINUED ACTIVE -
packaging shape Rectangle RECTANGULAR - Rectangle Rectangle Rectangle -
Package Size SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE -
surface mount Yes Yes - Yes Yes Yes -
Terminal form C BEND C BEND - C BEND C BEND C BEND -
terminal coating tin/silver NOT SPECIFIED - PURE Tin - PURE Tin -
Terminal location pair DUAL - pair pair pair -
Packaging Materials Plastic/Epoxy PLASTIC/EPOXY - Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy -
structure single SINGLE - single single single -
Diode component materials silicon SILICON - silicon silicon silicon -
Diode type Signal diode SIGNAL DIODE SIGNAL DIODE Signal diode Signal diode Signal diode -
Maximum repetitive peak reverse voltage 1000 V 50 V - 100 V 400 V 600 V -
Maximum average forward current 1 A 1 A - 1 A 1 A 1 A -

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