BL
FEATURES
GALAXY ELECTRICAL
S3A --- S3M
111REVERSE
VOLTAGE: 50 --- 1000 V
CURRENT:
3.0
A
SURFACE MOUNT RECTIFIER
Plastic package has underwriters laboratory
111
flammability classification 94V-0
For surface mounted applications
Low profile package
Built-in strain relief,ideal for automated placement
Glass passivated chip junction
High temperature soldering:
111
250
o
C/10 seconds at terminals
DO - 214AB(SMC)
MECHANICAL DATA
Case:JEDEC DO-214AB,molded plastic over
1111passivated
chip
Terminals:Solder plated, solderable per MIL-STD-
1111750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.007 ounces, 0.21 gram
inch(mm)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified
S3A
Device marking code
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC Blocking Voltage
Maximum average forw ord rectified current
V
@ T
L
=90
O
C
Peak forw ard surge current @ T
L
= 110°C 8.3ms
V
single half-sine-w ave superimposed on rated
V
load(JEDEC Method)
Maximum Instantaneous forw ard voltage at 3.0 A
Maximum DC reverse current
at rated DC blockjing voltage
@T
A
=25
o
C
@T
A
=125
o
C
S3B
SB
100
70
100
S3D
SD
200
140
200
S3G
SG
400
280
400
3.0
100.0
1.15
1.0
125.0
S3J
SJ
600
420
600
S3K
SK
800
560
800
S3M
UNITS
SM
1000
700
1000
V
V
V
A
A
V
SA
V
RRM
V
RWS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
R
R
JA
JL
50
35
50
Typical junction capacitance (NOTE 2)
Typical thermal resitance (NOTE 3)
30.0
53.0
16.0
-55--------+150
o
pF
C/W
o
Operating junction and storage temperature range
T
J
T
STG
NOTE: 1.Measured at 1.0MHz and applied reverse voltage of 4.0 Volts
C
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2. Thermal resistance f rom junction to ambient and junction to lead P.C.B.mounted on 0.27''X0.27''(7.0X7.0mm2) copper pad areas
Document Number 0280010
BL
GALAXY ELECTRICAL
1.
RATINGS AND CHARACTERISTIC CURVES
FIG.1 -- FORWARD DERATING CURVE
PEAK FORWARD SURGE
CURRENT,AMPERES
Resistive or inductive
Load
S3A---S3M
FIG.2 PEAK FORWARD SURGE CURRENT
AVERAGE FORWARD
CURRENT,AMPERES
3.0
100
T
L
=110 C
8.3ms Single Half Sine Wave
(JEDEC Method)
O
2.0
50
1.0
60Hz Resistive or
Inductive load
P.C.B.MOUNTED
0.27''X0.27''(7.0X7.0mm)
THICK COPPERPAND AREAS
0
50 60
70
80
90
100 110 120 130 140 150
1
1
10
1 00
LEAD TEMPERATURE
NUMBER OF CYCLES AT 60Hz
FIG.3 -- TYPICAL FORWARD CHARACTERISTICS
INSTANTANEOUS FORWARD
CURRENT,AMPERES
INSTANTANEOUS REVERSE
CURRENT,MICROAMPERES
100
FIG.4 -- TYPICAL REVERSE CHARACTERISTICS
100
10
10
T
J
=125 C
O
1
T
J
=25 C
O
1
T
J
=75 C
O
0.1
0.1
Puise Width=300 S
1%DUTY CYCLE
0.01
T
J
=25
O
C
0.01
0.4
0.6
0.8
1.0.
1.2
1.4
1.6
1.8
2.0
0.001
0
20
40
60
80
100
INSTANTANEOUS FORWARD VOLTAGE,VOLTS
PERCENT OF RATED PEAK REVERSE VOLTAGE,
FIG.5-TYPICAL JUNCTION CAPACITANCE
100
JUNCTION CAPACITANCE pF
30
10
T
J
=25
f=1.0MHZ
Vsig=50mVp-p
1
0.01
0.1
1
4
10
100
REVERSE VOLTAGE,VOLTS
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Document Number 0280010
BL
GALAXY ELECTRICAL
2.
DSP and ARM Processors
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