IDT7014S20J datasheet, PDF - EEWORLD Datasheet

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IDT7014S20J: DescriptionDual-Port SRAM, 4KX9, 20ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52; Categorystorage storage; File Size76KB，9 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT7014S20J Overview

Dual-Port SRAM, 4KX9, 20ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52

IDT7014S20J Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	LCC
package instruction	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
Contacts	52
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	20 ns
Other features	LOW POWER STANDBY MODE; BATTERY BACK-UP
I/O type	COMMON
JESD-30 code	S-PQCC-J52
JESD-609 code	e0
length	19.1262 mm
memory density	36864 bit
Memory IC Type	DUAL-PORT SRAM
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	52
word count	4096 words
character code	4000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum slew rate	0.245 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	19.1262 mm

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HIGH-SPEED

4K x 9DUAL-PORT

STATIC RAM

Features:

IDT7014S

Description:

The IDT7014 is a high-speed 4K x 9 Dual-Port Static RAM designed

to be used in systems where on-chip hardware port arbitration is not

needed. This part lends itself to high-speed applications which do not rely

on BUSY signals to manage simultaneous access.

The IDT7014 provides two independent ports with separate control,

address, and I/O pins that permit independent, asynchronous access for

reads or writes to any location in memory. See functional description.

The IDT7014 utilitizes a 9-bit wide data path to allow for parity at the

user's option. This feature is especially useful in data communication

applications where it is necessary to use a parity bit for transmission/

reception error checking.

Fabricated using IDT’s high-performance technology, these Dual-

Ports typically operate on only 750mW of power at maximum access times

as fast as 12ns.

The IDT7014 is packaged in a 52-pin PLCC and a 64-pin thin quad

flatpack, (TQFP).

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Commercial: 12/15/20/25ns (max.)

– Industrial: 15/20/25ns (max.)

Standard-power operation

– IDT7014S

Active: 750mW (typ.)

Fully asynchronous operation from either port

TTL-compatible; single 5V (±10%) power supply

Available in 52-pin PLCC and a 64-pin TQFP

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Functional Block Diagram

I/O

- I/O

I/O

CONTROL

I/O

CONTROL

I/O

- I/O

- A

11L

ADDRESS

DECODER

MEMORY

ARRAY

ADDRESS

DECODER

- A

11R

2528 drw 01

MARCH 2000

DSC 2528/13

IDT7014S20J Related Products

	IDT7014S20J	IDT7014S25J	IDT7014S25JI	IDT7014S25PFI	IDT7014S15PFI	IDT7014S15J	IDT7014S15JI	IDT7014S25PF
Description	Dual-Port SRAM, 4KX9, 20ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 25ns, PQCC52, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 25ns, PQFP64, TQFP-64	Dual-Port SRAM, 4KX9, 15ns, PQFP64, TQFP-64	Dual-Port SRAM, 4KX9, 15ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 15ns, PQCC52, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	LCC	LCC	QFP	QFP	LCC	LCC	QFP
package instruction	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	QCCJ, LDCC52,.8SQ	LQFP, QFP64,.66SQ,32	LQFP, QFP64,.66SQ,32	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	QCCJ, LDCC52,.8SQ	14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Contacts	52	52	52	64	64	52	52	64
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	20 ns	25 ns	25 ns	25 ns	15 ns	15 ns	15 ns	25 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQFP-G64	S-PQFP-G64	S-PQCC-J52	S-PQCC-J52	S-PQFP-G64
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	19.1262 mm	19.1262 mm	19.1262 mm	14 mm	14 mm	19.1262 mm	19.1262 mm	14 mm
memory density	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	9	9	9	9	9	9	9	9
Humidity sensitivity level	3	3	1	3	3	3	1	3
Number of functions	1	1	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2	2	2
Number of terminals	52	52	52	64	64	52	52	64
word count	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000	4000	4000	4000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	SYNCHRONOUS	ASYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C	85 °C	70 °C
organize	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	LQFP	LQFP	QCCJ	QCCJ	LQFP
Encapsulate equivalent code	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	QFP64,.66SQ,32	QFP64,.66SQ,32	LDCC52,.8SQ	LDCC52,.8SQ	QFP64,.66SQ,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	CHIP CARRIER	CHIP CARRIER	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	240	240	225	225	240
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	4.572 mm	4.57 mm	1.6 mm	1.6 mm	4.572 mm	4.57 mm	1.6 mm
Maximum slew rate	0.245 mA	0.24 mA	0.255 mA	0.255 mA	0.26 mA	0.25 mA	0.26 mA	0.24 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	TIN LEAD	TIN LEAD	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	J BEND	J BEND	J BEND	GULL WING	GULL WING	J BEND	J BEND	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	0.8 mm	0.8 mm	1.27 mm	1.27 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	20	20	30	30	20
width	19.1262 mm	19.1262 mm	19.1262 mm	14 mm	14 mm	19.1262 mm	19.1262 mm	14 mm
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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