IDT72V3656L20PF datasheet, PDF

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IDT72V3656L20PF: DescriptionFIFO, 2KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128; Categorystorage storage; File Size399KB，6 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT72V3656L20PF Overview

FIFO, 2KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128

IDT72V3656L20PF Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	QFP
package instruction	TQFP-128
Contacts	128
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	12 ns
Other features	MAIL BOX BYPASS REGISTER
period time	20 ns
JESD-30 code	R-PQFP-G128
JESD-609 code	e0
length	20 mm
memory density	73728 bit
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	128
word count	2048 words
character code	2000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX36
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm

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IDT72V3656L20PF Related Products

	IDT72V3656L20PF	IDT72V3666L20PF	IDT72V3676L20PF	IDT72V3686L20PF	IDT72V36106L20PF	IDT72V3696L20PF	IDT72V3696L20PFG	IDT72V3686L20PFG
Description	FIFO, 2KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 4KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 8KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 64KX36, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 32KX36, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 32KX36, Synchronous, CMOS, PQFP128, TQFP-128	FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Lead free	Lead free
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	conform to	conform to
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	TQFP-128	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,
Contacts	128	128	128	128	128	128	128	128
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
period time	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns
JESD-30 code	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128
JESD-609 code	e0	e0	e0	e0	e0	e0	e3	e3
length	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	73728 bit	147456 bit	294912 bit	589824 bit	2359296 bit	1179648 bit	1179648 bit	589824 bit
memory width	36	36	36	36	36	36	36	36
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	128	128	128	128	128	128	128	128
word count	2048 words	4096 words	8192 words	16384 words	65536 words	32768 words	32768 words	16384 words
character code	2000	4000	8000	16000	64000	32000	32000	16000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2KX36	4KX36	8KX36	16KX36	64KX36	32KX36	32KX36	16KX36
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	240	240	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	20	20	20	20	20	20	30	30
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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