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IDT72V3686L20PFG

Description
FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128
Categorystorage    storage   
File Size399KB,6 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
Download Datasheet Parametric Compare View All

IDT72V3686L20PFG Overview

FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128

IDT72V3686L20PFG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionLFQFP,
Contacts128
Reach Compliance Codecompliant
ECCN codeEAR99
period time20 ns
JESD-30 codeR-PQFP-G128
JESD-609 codee3
length20 mm
memory density589824 bit
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals128
word count16384 words
character code16000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16KX36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.6 mm
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm

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Description FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 4KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 8KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 2KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 64KX36, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 32KX36, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 32KX36, Synchronous, CMOS, PQFP128, TQFP-128
Is it lead-free? Lead free Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Lead free
Is it Rohs certified? conform to incompatible incompatible incompatible incompatible incompatible incompatible conform to
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP
package instruction LFQFP, LFQFP, LFQFP, LFQFP, TQFP-128 LFQFP, LFQFP, LFQFP,
Contacts 128 128 128 128 128 128 128 128
Reach Compliance Code compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
period time 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns
JESD-30 code R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609 code e3 e0 e0 e0 e0 e0 e0 e3
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 589824 bit 147456 bit 294912 bit 589824 bit 73728 bit 2359296 bit 1179648 bit 1179648 bit
memory width 36 36 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 128 128 128 128 128 128 128 128
word count 16384 words 4096 words 8192 words 16384 words 2048 words 65536 words 32768 words 32768 words
character code 16000 4000 8000 16000 2000 64000 32000 32000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 16KX36 4KX36 8KX36 16KX36 2KX36 64KX36 32KX36 32KX36
Exportable YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 240 240 240 240 240 240 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD Matte Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 20 20 20 20 20 20 30
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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