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MM74HCT109N/A+

Description
IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,PLASTIC
Categorylogic    logic   
File Size167KB,3 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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MM74HCT109N/A+ Overview

IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,PLASTIC

MM74HCT109N/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Logic integrated circuit typeJ-K FLIP-FLOP
Number of functions2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Trigger typePOSITIVE EDGE

MM74HCT109N/A+ Related Products

MM74HCT109N/A+ MM74HCT109N/B+ MM54HCT109J/883B MM54HCT109J/883C MM54HCT109J/883
Description IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,PLASTIC IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,PLASTIC IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,CERAMIC IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,CERAMIC IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T16 R-PDIP-T16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0 e0
Logic integrated circuit type J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP
Number of functions 2 2 2 2 2
Number of terminals 16 16 16 16 16
Maximum operating temperature 85 °C 85 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -55 °C -55 °C -55 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Filter level - - 38535Q/M;38534H;883B MIL-STD-883 Class C 38535Q/M;38534H;883B
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