IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | J-K FLIP-FLOP |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| MM54HCT109J/883 | MM74HCT109N/B+ | MM74HCT109N/A+ | MM54HCT109J/883B | MM54HCT109J/883C | |
|---|---|---|---|---|---|
| Description | IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HCT-CMOS,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| Number of functions | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | - | - | 38535Q/M;38534H;883B | MIL-STD-883 Class C |
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