BR100/03/T/R datasheet, PDF - EEWORLD Datasheet

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BR100/03/T/R: Description36V, DIAC, DO-35; CategoryAnalog mixed-signal IC Trigger device; File Size16KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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BR100/03/T/R Overview

36V, DIAC, DO-35

BR100/03/T/R Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum breakover voltage	36 V
Minimum breakover voltage	28 V
Shell connection	ISOLATED
Configuration	SINGLE
JEDEC-95 code	DO-35
JESD-30 code	O-LALF-W2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Maximum operating temperature	100 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
surface mount	NO
Terminal surface	Matte Tin (Sn)
Terminal form	WIRE
Terminal location	AXIAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Trigger device type	DIAC

BR100/03/T/R Preview

Philips Semiconductors

Product Specification

Silicon Bi-directional Trigger Device

BR100/03

GENERAL DESCRIPTION

Silicon bidirectional trigger device in a

glass envelope intended for use in

triac and thyristor trigger circuits.

QUICK REFERENCE DATA

SYMBOL

(BO)

FRM

PARAMETER

Breakover voltage

Output voltage

Repetitive peak forward current

MIN.

MAX.

UNIT

OUTLINE - SOD27

SYMBOL

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL

FRM

tot

stg

PARAMETER

Repetitive peak forward

current

Total power dissipation

Storage temperature

Operating junction

temperature

CONDITIONS

≤

µs,

≤

50˚C; f = 60 Hz

= 50˚C

MIN.

-55

MAX.

150

125

100

UNIT

˚C

THERMAL RESISTANCES

SYMBOL

th j-a

th j-lead

PARAMETER

CONDITIONS

MIN.

TYP.

330

150

MAX. UNIT

K/W

Thermal resistance junction to in free air

ambient

Thermal resistance junction to

leads

CHARACTERISTICS

= 25 ˚C unless otherwise stated.

SYMBOL

(BO)

(BO)+

| - |V

(BO)-

(BO)

/dT

PARAMETER

Breakover voltage

Breakover voltage symmetry

Output voltage

Breakover current

Temperature coefficient of

(BO)

Risetime

CONDITIONS

I = I

(BO)

I = I

(BO)

, see fig: 1

= 20

Ω;

Circuit of fig: 2

V = V

(BO)

= 0.5 A; Circuit of fig: 2

MIN.

TYP.

0.1

1.5

MAX. UNIT

3.5

µA

%/K

µs

February 1996

Rev 1.100

Philips Semiconductors

Product Specification

Silicon Bi-directional Trigger Device

BR100/03

VBO

D.U.T.

10k

I(BO)I

500k

V(BO)III

V(BO)I

I(BO)III

100nF

230 V, RMS, 50Hz

10R

Set load resistance

to 20 Ohms when

measuring output voltage

50R

Adjust for Ip=0.5A

when measuring risetime

Fig.1. Current-voltage characteristics

Fig.2. Test circuit for output voltage and risetime.

MECHANICAL DATA

Dimensions in mm

4.5

max

0.56

max

1.95

max

min

Fig.3. SOD27.

February 1996

Rev 1.100

Philips Semiconductors

Product Specification

Silicon Bi-directional Trigger Device

BR100/03

DEFINITIONS

Data sheet status

Objective specification

Product specification

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or at any other conditions above those given in the Characteristics sections of

this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 1997

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the

The information presented in this document does not form part of any quotation or contract, it is believed to be

accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under patent or other

industrial or intellectual property rights.

This data sheet contains target or goal specifications for product development.

This data sheet contains final product specifications.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these

products can be reasonably expected to result in personal injury. Philips customers using or selling these products

for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting

from such improper use or sale.

February 1996

Rev 1.100

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BR100/03/T/R Related Products

	BR100/03/T/R	BR100/03,113	BR100/03T/R	BR100/03
Description	36V, DIAC, DO-35	DIAC 28-36V 2A ALF2	DIAC, 36 V, DIAC, DO-35, HERMETIC SEALED, GLASS PACKAGE-2	DIAC, 36 V, DIAC, DO-35
Is it Rohs certified?	conform to	conform to	conform to	conform to
Reach Compliance Code	not_compliant	unknown	compliant	unknown
Maximum breakover voltage	36 V	36 V	36 V	36 V
Minimum breakover voltage	28 V	28 V	28 V	28 V
Shell connection	ISOLATED	ISOLATED	ISOLATED	ISOLATED
Configuration	SINGLE	SINGLE	SINGLE	SINGLE
JEDEC-95 code	DO-35	DO-35	DO-35	DO-35
JESD-30 code	O-LALF-W2	O-LALF-W2	O-LALF-W2	O-LALF-W2
Number of components	1	1	1	1
Number of terminals	2	2	2	2
Maximum operating temperature	100 °C	100 °C	100 °C	100 °C
Package body material	GLASS	GLASS	GLASS	GLASS
Package shape	ROUND	ROUND	ROUND	ROUND
Package form	LONG FORM	LONG FORM	LONG FORM	LONG FORM
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
Terminal form	WIRE	WIRE	WIRE	WIRE
Terminal location	AXIAL	AXIAL	AXIAL	AXIAL
Trigger device type	DIAC	DIAC	DIAC	DIAC
Maker	NXP	-	NXP	NXP
ECCN code	EAR99	EAR99	-	EAR99
JESD-609 code	e3	e3	e3	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
package instruction	-	HERMETIC SEALED, GLASS PACKAGE-2	LONG FORM, O-LALF-W2	LONG FORM, O-LALF-W2

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