|
BTA212X-500D |
BTA212X-500E |
BTA212X-500F |
| Description |
500V, 12A, 4 QUADRANT LOGIC LEVEL TRIAC |
500V, 12A, TRIAC |
500V, 12A, TRIAC |
| Maker |
NXP |
NXP |
NXP |
| Reach Compliance Code |
compliant |
compliant |
unknown |
| Shell connection |
ISOLATED |
ISOLATED |
ISOLATED |
| Configuration |
SINGLE |
SINGLE |
SINGLE |
| Critical rise rate of minimum off-state voltage |
10 V/us |
20 V/us |
50 V/us |
| Maximum DC gate trigger current |
5 mA |
10 mA |
25 mA |
| Maximum DC gate trigger voltage |
1.5 V |
1.5 V |
1.5 V |
| Maximum holding current |
6 mA |
12 mA |
30 mA |
| JESD-30 code |
R-PSFM-T3 |
R-PSFM-T3 |
R-PSFM-T3 |
| Number of components |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum rms on-state current |
12 A |
12 A |
12 A |
| Maximum repetitive peak off-state leakage current |
500 µA |
500 µA |
500 µA |
| Off-state repetitive peak voltage |
500 V |
500 V |
500 V |
| surface mount |
NO |
NO |
NO |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
SINGLE |
SINGLE |
SINGLE |
| Trigger device type |
4 QUADRANT LOGIC LEVEL TRIAC |
TRIAC |
TRIAC |
| Maximum leakage current |
0.5 mA |
0.5 mA |
- |
| package instruction |
- |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |