JS28F256P30TFE datasheet, PDF - EEWORLD Datasheet

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JS28F256P30TFE: DescriptionFlash, 16MX16, 20ns, PDSO56, TSOP-56; Categorystorage storage; File Size1MB，98 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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JS28F256P30TFE Overview

Flash, 16MX16, 20ns, PDSO56, TSOP-56

JS28F256P30TFE Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
package instruction	TSSOP, TSSOP56,.8,20
Reach Compliance Code	compliant
ECCN code	3A991
Maximum access time	20 ns
Other features	IT ALSO HAVE ASYNCHRONOUS OPERATING MODE
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	R-PDSO-G56
JESD-609 code	e3
length	18.4 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	4,255
Number of terminals	56
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP56,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8,1.8/3.3 V
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1.025 mm
Department size	16K,64K
Maximum standby current	0.00021 A
Maximum slew rate	0.031 mA
Maximum supply voltage (Vsup)	2 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	NOR TYPE
width	14 mm
Base Number Matches	1

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256Mb and 512Mb (256Mb/256Mb),

P30-65nm

Features

Micron Parallel NOR Flash Embedded

Memory (P30-65nm)

JS28F256P30B/TFx, RC28F256P30B/TFx, PC28F256P30B/TFx,

RD48F4400P0VBQEx, RC48F4400P0VB0Ex,

PC48F4400P0VB0Ex, PF48F4000P0ZB/TQEx

Features

• High performance

– 100ns initial access for Easy BGA

– 110ns initial access for TSOP

– 25ns 16-word asychronous page read mode

– 52 MHz (Easy BGA) with zero WAIT states and

17ns clock-to-data output synchronous burst

read mode

– 4-, 8-, 16-, and continuous word options for burst

mode

– Buffered enhanced factory programming (BEFP)

at 2 MB/s (TYP) using a 512-word buffer

– 1.8V buffered programming at 1.14 MB/s (TYP)

using a 512-word buffer

• Architecture

– MLC: highest density at lowest cost

– Asymmetrically blocked architecture

– Four 32KB parameter blocks: top or bottom con-

figuration

– 128KB main blocks

– Blank check to verify an erased block

• Voltage and power

– V

(core) voltage: 1.7V to 2.0V

– V

CCQ

(I/O) voltage: 1.7V to 3.6V

– Standy current: 65µA (TYP) for 256Mb

– 52 MHz continuous synchronous read current:

21mA (TYP), 24mA (MAX)

• Security

– One-time programmable register: 64 OTP bits,

programmed with unique information from Mi-

cron; 2112 OTP bits available for customer pro-

gramming

– Absolute write protection: V

= V

– Power-transition erase/program lockout

– Individual zero-latency block locking

– Individual block lock-down

– Password access

• Software

– 25μs (TYP) program suspend

– 25μs (TYP) erase suspend

– Flash Data Integrator optimized

– Basic command set and extended function Inter-

face (EFI) command set compatible

– Common flash interface

• Density and Packaging

– 56-lead TSOP package (256Mb only)

– 64-ball Easy BGA package (256Mb, 512Mb)

– QUAD+ and SCSP packages (256Mb, 512Mb)

– 16-bit wide data bus

• Quality and reliabilty

– JESD47 compliant

– Operating temperature: –40°C to +85°C

– Minimum 100,000 ERASE cycles per block

– 65nm process technology

PDF: 09005aef84566799

p30_65nm_MLC_256Mb-512mb.pdf - Rev. D 9/15 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb and 512Mb (256Mb/256Mb),

P30-65nm

Features

Contents

General Description ......................................................................................................................................... 9

Virtual Chip Enable Description ........................................................................................................................ 9

Memory Map ................................................................................................................................................. 12

Package Dimensions ....................................................................................................................................... 13

Pinouts and Ballouts ....................................................................................................................................... 17

Signal Descriptions ......................................................................................................................................... 21

Bus Operations ............................................................................................................................................... 24

Read .......................................................................................................................................................... 24

Write .......................................................................................................................................................... 24

Output Disable ........................................................................................................................................... 24

Standby ..................................................................................................................................................... 24

Reset .......................................................................................................................................................... 25

Device Command Codes ................................................................................................................................. 26

Device Command Bus Cycles .......................................................................................................................... 29

Read Operations ............................................................................................................................................. 31

Asynchronous Page Mode Read ................................................................................................................... 31

Asynchronous Single Word Read ................................................................................................................. 31

Synchronous Burst Mode Read ................................................................................................................... 32

Read CFI .................................................................................................................................................... 32

Read Device ID ........................................................................................................................................... 32

Device ID Codes ............................................................................................................................................. 33

Program Operations ....................................................................................................................................... 34

Word Programming (40h) ........................................................................................................................... 34

Buffered Programming (E8h, D0h) .............................................................................................................. 34

Buffered Enhanced Factory Programming (80h, D0h) ................................................................................... 35

Program Suspend ....................................................................................................................................... 37

Program Resume ........................................................................................................................................ 38

Program Protection .................................................................................................................................... 38

Erase Operations ............................................................................................................................................ 39

BLOCK ERASE Command ........................................................................................................................... 39

BLANK CHECK Command .......................................................................................................................... 39

ERASE SUSPEND Command ....................................................................................................................... 40

ERASE RESUME Command ........................................................................................................................ 40

Erase Protection ......................................................................................................................................... 40

Security Operations ........................................................................................................................................ 41

Block Locking ............................................................................................................................................. 41

BLOCK LOCK Command ............................................................................................................................ 41

BLOCK UNLOCK Command ....................................................................................................................... 41

BLOCK LOCK DOWN Command ................................................................................................................. 41

Block Lock Status ....................................................................................................................................... 41

Block Locking During Suspend ................................................................................................................... 42

Selectable OTP Blocks ................................................................................................................................. 43

Password Access ......................................................................................................................................... 43

Status Register ................................................................................................................................................ 44

Read Status Register ................................................................................................................................... 44

Clear Status Register ................................................................................................................................... 45

Configuration Register .................................................................................................................................... 46

Read Configuration Register ....................................................................................................................... 46

Read Mode ................................................................................................................................................. 46

Latency Count ............................................................................................................................................ 47

PDF: 09005aef84566799

p30_65nm_MLC_256Mb-512mb.pdf - Rev. D 9/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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