EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Catalyst |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | WRITE PROTECT; I2C BUS SERIAL INTERFACE; AUTOMATIC WRITE |
| Maximum clock frequency (fCLK) | 0.1 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDDR |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| length | 9.36 mm |
| memory density | 2048 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X8 |
| Output characteristics | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Serial bus type | I2C |
| Maximum standby current | 9e-7 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.62 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | HARDWARE |
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