IC,LOGIC GATE,HEX INVERTER,AC-CMOS,SOP,14PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | SOP, SOP14,.25 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | INVERTER |
| MaximumI(ol) | 0.012 A |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP14,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| method of packing | TAPE AND REEL |
| power supply | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 9 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| MC74AC05DR2 | MC74ACT05DR2 | MC74AC05D | |
|---|---|---|---|
| Description | IC,LOGIC GATE,HEX INVERTER,AC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,HEX INVERTER,ACT-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,HEX INVERTER,AC-CMOS,SOP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP |
| package instruction | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 code | e0 | e0 | e0 |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER |
| MaximumI(ol) | 0.012 A | 0.024 A | 0.012 A |
| Number of terminals | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP |
| Encapsulate equivalent code | SOP14,.25 | SOP14,.25 | SOP14,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 3.3/5 V | 5 V | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 9 ns | 9 ns | 9 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| method of packing | TAPE AND REEL | TAPE AND REEL | - |