IC,PROM,32X8,TTL,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 35 ns |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 16 |
| word count | 32 words |
| character code | 32 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 32X8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum slew rate | 0.11 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DM54S288AJ/A+ | DM74S288AN/A+ | WBDDSS8-A-00-2180-D-B | DM74S288AJ/A+ | DM74S288J/A+ | |
|---|---|---|---|---|---|
| Description | IC,PROM,32X8,TTL,DIP,16PIN,CERAMIC | IC,PROM,32X8,TTL,DIP,16PIN,PLASTIC | Array/Network Resistor, Isolated, 0.1W, 218ohm, 100V, 0.5% +/-Tol, -300,300ppm/Cel, 1408, | IC,PROM,32X8,TTL,DIP,16PIN,CERAMIC | IC,PROM,32X8,TTL,DIP,16PIN,CERAMIC |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 70 °C | 150 °C | 70 °C | 70 °C |
| Package form | IN-LINE | IN-LINE | SMT | IN-LINE | IN-LINE |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Maximum access time | 35 ns | 25 ns | - | 25 ns | 35 ns |
| JESD-30 code | R-XDIP-T16 | R-PDIP-T16 | - | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | - | e0 | e0 |
| Memory IC Type | OTP ROM | OTP ROM | - | OTP ROM | OTP ROM |
| memory width | 8 | 8 | - | 8 | 8 |
| word count | 32 words | 32 words | - | 32 words | 32 words |
| character code | 32 | 32 | - | 32 | 32 |
| organize | 32X8 | 32X8 | - | 32X8 | 32X8 |
| Package body material | CERAMIC | PLASTIC/EPOXY | - | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | - | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | - | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| power supply | 5 V | 5 V | - | 5 V | 5 V |
| Maximum slew rate | 0.11 mA | 0.11 mA | - | 0.11 mA | 0.11 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | 5 V |
| surface mount | NO | NO | - | NO | NO |
| technology | TTL | TTL | - | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | - | DUAL | DUAL |
| Base Number Matches | - | 1 | - | 1 | 1 |