FIFO, 32KX9, 15ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | QFJ |
| package instruction | CERAMIC, LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 33.3 MHz |
| period time | 30 ns |
| JESD-30 code | R-CQCC-N32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 294912 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX9 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.286 mm |
| Maximum standby current | 0.02 A |
| Maximum slew rate | 0.16 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 11.43 mm |
| CY7C474-15LC | CY7C470-40LC | CY7C472-25LC | CY7C472-15LC | CY7C472-40LC | CY7C470-15LC | CY7C474-25LC | CY7C474-40LC | CY7C470-25LC | |
|---|---|---|---|---|---|---|---|---|---|
| Description | FIFO, 32KX9, 15ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 8KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 16KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 16KX9, 15ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 16KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 8KX9, 15ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 32KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 32KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 8KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | QFJ | QFJ | QFJ | QFJ | QFJ | QFJ | QFJ | QFJ | QFJ |
| package instruction | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 15 ns | 40 ns | 25 ns | 15 ns | 40 ns | 15 ns | 25 ns | 40 ns | 25 ns |
| Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| Maximum clock frequency (fCLK) | 33.3 MHz | 20 MHz | 28.5 MHz | 33.3 MHz | 20 MHz | 33.5 MHz | 28.5 MHz | 20 MHz | 28.5 MHz |
| period time | 30 ns | 50 ns | 35 ns | 30 ns | 50 ns | 30 ns | 35 ns | 50 ns | 35 ns |
| JESD-30 code | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm |
| memory density | 294912 bit | 73728 bit | 147456 bit | 147456 bit | 147456 bit | 73728 bit | 294912 bit | 294912 bit | 73728 bit |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 32768 words | 8192 words | 16384 words | 16384 words | 16384 words | 8192 words | 32768 words | 32768 words | 8192 words |
| character code | 32000 | 8000 | 16000 | 16000 | 16000 | 8000 | 32000 | 32000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 32KX9 | 8KX9 | 16KX9 | 16KX9 | 16KX9 | 8KX9 | 32KX9 | 32KX9 | 8KX9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN | QCCN | QCCN | QCCN | QCCN | QCCN | QCCN | QCCN | QCCN |
| Encapsulate equivalent code | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm |
| Maximum standby current | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| Maximum slew rate | 0.16 mA | 0.125 mA | 0.145 mA | 0.16 mA | 0.125 mA | 0.16 mA | 0.145 mA | 0.125 mA | 0.145 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm |
| Maker | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |