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CY7C474-25LC

Description
FIFO, 32KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32
Categorystorage    storage   
File Size284KB,11 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric Compare View All

CY7C474-25LC Overview

FIFO, 32KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32

CY7C474-25LC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeQFJ
package instructionCERAMIC, LCC-32
Contacts32
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time25 ns
Other featuresRETRANSMIT
Maximum clock frequency (fCLK)28.5 MHz
period time35 ns
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density294912 bit
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals32
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX9
Output characteristics3-STATE
ExportableNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height2.286 mm
Maximum standby current0.02 A
Maximum slew rate0.145 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm

CY7C474-25LC Related Products

CY7C474-25LC CY7C470-40LC CY7C472-25LC CY7C474-15LC CY7C472-15LC CY7C472-40LC CY7C470-15LC CY7C474-40LC CY7C470-25LC
Description FIFO, 32KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 8KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 16KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 32KX9, 15ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 16KX9, 15ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 16KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 8KX9, 15ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 32KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 FIFO, 8KX9, 25ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFJ QFJ QFJ QFJ QFJ QFJ QFJ QFJ QFJ
package instruction CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32 CERAMIC, LCC-32
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 25 ns 40 ns 25 ns 15 ns 15 ns 40 ns 15 ns 40 ns 25 ns
Other features RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
Maximum clock frequency (fCLK) 28.5 MHz 20 MHz 28.5 MHz 33.3 MHz 33.3 MHz 20 MHz 33.5 MHz 20 MHz 28.5 MHz
period time 35 ns 50 ns 35 ns 30 ns 30 ns 50 ns 30 ns 50 ns 35 ns
JESD-30 code R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm
memory density 294912 bit 73728 bit 147456 bit 294912 bit 147456 bit 147456 bit 73728 bit 294912 bit 73728 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 32768 words 8192 words 16384 words 32768 words 16384 words 16384 words 8192 words 32768 words 8192 words
character code 32000 8000 16000 32000 16000 16000 8000 32000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 32KX9 8KX9 16KX9 32KX9 16KX9 16KX9 8KX9 32KX9 8KX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable NO NO NO NO NO NO NO NO NO
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN QCCN QCCN QCCN QCCN QCCN QCCN QCCN QCCN
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.286 mm 2.286 mm 2.286 mm 2.286 mm 2.286 mm 2.286 mm 2.286 mm 2.286 mm 2.286 mm
Maximum standby current 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A
Maximum slew rate 0.145 mA 0.125 mA 0.145 mA 0.16 mA 0.16 mA 0.125 mA 0.16 mA 0.125 mA 0.145 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm
Maker Cypress Semiconductor - Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor

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