IC,LOGIC GATE,3 3-INPUT AND,STD-TTL,DIP,14PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | AND GATE |
| MaximumI(ol) | 0.016 A |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 22 mA |
| Prop。Delay @ Nom-Sup | 27 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DM7411N/B+ | DM5411J/883C | DM7411J/A+ | DM7411N/A+ | |
|---|---|---|---|---|
| Description | IC,LOGIC GATE,3 3-INPUT AND,STD-TTL,DIP,14PIN,PLASTIC | IC,LOGIC GATE,3 3-INPUT AND,STD-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,3 3-INPUT AND,STD-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,3 3-INPUT AND,STD-TTL,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE |
| MaximumI(ol) | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
| Number of terminals | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 22 mA | 22 mA | 22 mA | 22 mA |
| Prop。Delay @ Nom-Sup | 27 ns | 27 ns | 27 ns | 27 ns |
| Schmitt trigger | NO | NO | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maker | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
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