DS1250Y-70 datasheet, PDF - EEWORLD Datasheet

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DS1250Y-70: Description512KX8 NON-VOLATILE SRAM MODULE, 70ns, DMA32, 0.740 INCH, DIP-32; Categorystorage storage; File Size978KB，13 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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DS1250Y-70 Overview

512KX8 NON-VOLATILE SRAM MODULE, 70ns, DMA32, 0.740 INCH, DIP-32

DS1250Y-70 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	MODULE
package instruction	0.740 INCH, DIP-32
Contacts	32
Reach Compliance Code	unknown
Maximum access time	70 ns
Other features	10 YEAR DATA RETENTION
JESD-30 code	R-XDMA-P32
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	NON-VOLATILE SRAM MODULE
memory width	8
Humidity sensitivity level	NOT SPECIFIED
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Certification status	COMMERCIAL
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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DS1250Y-70 Related Products

	DS1250Y-70	DS1250AB-70	DS1250ABP-70	DS1250AB-100	DS1250YP-100	DS1250ABP-70IND	DS1250ABP-100
Description	512KX8 NON-VOLATILE SRAM MODULE, 70ns, DMA32, 0.740 INCH, DIP-32	512KX8 NON-VOLATILE SRAM MODULE, 70ns, DMA32, 0.740 INCH, DIP-32	512KX8 NON-VOLATILE SRAM MODULE, 70ns, DMA34, POWERCAP MODULE-34	512KX8 NON-VOLATILE SRAM MODULE, 100ns, DMA32, 0.740 INCH, DIP-32	512KX8 NON-VOLATILE SRAM MODULE, 100ns, DMA34, POWERCAP MODULE-34	512KX8 NON-VOLATILE SRAM MODULE, 70ns, DMA34, POWERCAP MODULE-34	512KX8 NON-VOLATILE SRAM MODULE, 100ns, DMA34, POWERCAP MODULE-34
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	MODULE	MODULE	DMA	MODULE	DMA	DMA	DMA
package instruction	0.740 INCH, DIP-32	0.740 INCH, DIP-32	POWERCAP MODULE-34	0.740 INCH, DIP-32	POWERCAP MODULE-34	POWERCAP MODULE-34	POWERCAP MODULE-34
Contacts	32	32	34	32	34	34	34
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	70 ns	70 ns	70 ns	100 ns	100 ns	70 ns	100 ns
Other features	10 YEAR DATA RETENTION	10 YEAR DATA RETENTION	10 YEAR DATA RETENTION	10 YEAR DATA RETENTION	10 YEAR DATA RETENTION	10 YEAR DATA RETENTION	10 YEAR DATA RETENTION
JESD-30 code	R-XDMA-P32	R-XDMA-P32	R-XDMA-U34	R-XDMA-P32	R-XDMA-U34	R-XDMA-U34	R-XDMA-U34
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE
memory width	8	8	8	8	8	8	8
Humidity sensitivity level	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	34	32	34	34	34
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	240	225	240
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum supply voltage (Vsup)	5.5 V	5.25 V	5.25 V	5.25 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.75 V	4.75 V	4.75 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	PIN/PEG	PIN/PEG	J INVERTED	PIN/PEG	J INVERTED	J INVERTED	J INVERTED
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED

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